Eastman-kodak Company

Xerox Corporation

Fuji Xerox Co., Ltd.

Christopher R Morton

Gary Alan Kneezel

Juan J Becerra

John Andrew Lebens

Yonglin Xie

David P Trauernicht

Christopher Newell Delametter

James Michael Chwalek

Cathie J Burke

Carolyn Rae Ellinger

Roger Guy Markham

Thomas A Tellier

Thomas E Watrobski

Andrew S Yeh

Eduardo Mariano Freire

Ronald S Cok

David Allen Mantell

Thomas Nathaniel Tombs

Shelby Forrester Nelson

William G Hawkins

David M Orlicki

Lesley P Dudek

Mario Joseph Ciminelli

Yungran Choi

David Paul Trauernicht

David Mark Orlicki

An electronic device includes a vertical-support-element with first and second edges having first and second reentrant profiles, respectively. The first reentrant profile includes first conformal semiconductor and dielectric layers, and a conformal conductive top-gate. A first electrode contacts a first portion of the first conformal semiconductor layer over the top of the vertical-support-element. A second electrode, adjacent to the first edge, contacts a second portion of the first conformal semiconductor layer not over the vertical-support-element. The second reentrant profile includes a conformal conductive bottom-gate, and second conformal dielectric and semiconductor layers. A third electrode, adjacent to the second edge, contacts the second semiconductor layer not over the vertical-support-element. A fourth electrode, over the vertical-support-element, contacts the second semiconductor layer. The first and second electrodes define a first semiconductor channel of a top-gate transistor, the third and fourth electrodes define a second semiconductor channel of a bottom-gate transistor.

Bottom-gate and top-gate VTFTs on common structure

A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.

Wrap-around micro-wire circuit method

An electronic component includes a first transistor on a substrate. The first transistor includes a first source, a first drain, a first gate dielectric, a first gate, and a first semiconductor channel having a first length. At least a portion of the first semiconductor channel extends in a direction parallel to the substrate. A vertical-support-element on the substrate has a first reentrant profile. A second transistor includes a second source, a second drain, a second gate dielectric, and a second gate having a second semiconductor channel. At least a portion of the second semiconductor channel extends in a direction orthogonal to the substrate in the first reentrant profile of the vertical-support-element.

Vertical and planar TFTS on common substrate

An inkjet printhead includes an array of resistive heaters; an array of nozzles associated with the array of resistive heaters; a heater voltage input for providing a heater voltage; a fire control pulse input for providing a fire control pulse having a first pulsewidth for controlling a length of time that current from the heater voltage input is allowed to pass through at least one of the resistive heaters; and a protective circuit configured to receive the fire control pulse from the fire control pulse input, and to override the fire control pulse if the first pulsewidth is greater than or equal to a predetermined length of time.

Protective circuit for inkjet printhead

A printer includes a printhead die including liquid ejectors separated by walls. Each liquid ejector includes a nozzle orifice and an associated drop forming mechanism. First and second liquid feed channels, extending in opposite directions, are in fluid communication with each liquid ejector. A liquid inlet includes a plurality of first and second segments in fluid communication with the first liquid feed channels and the second liquid feed channels, respectively. The first and second segments are located on opposite sides of the nozzle orifice. For a given liquid ejector, both of the first and second segments are directly in line with the liquid ejector. An electrical lead extends from each drop forming mechanism toward an edge of the printhead die. At least one of the electrical leads is positioned between neighboring segments of at least one of the first and second segments of the liquid inlet.

Liquid drop ejection using dual feed ejector

A liquid ejector includes a structure defining a plurality of chambers with one of the chambers including a first and second surface. The first surface includes a nozzle orifice. A drop forming mechanism is located on the second surface of the chamber opposite the nozzle orifice. First and second liquid feed channels are in fluid communication with the chamber. First and second segments of a segmented liquid inlet are in fluid communication with the first and second liquid feed channels, respectively. The first and second segments of the segmented liquid inlet are also in fluid communication with another one of the plurality of chambers. Liquid is provided to the chamber through the first and second liquid feed channels from the segmented liquid inlet. A drop of the liquid is ejected through the nozzle orifice of the chamber by operating the drop forming mechanism.

A method of characterizing an array of resistive heaters, a first resistive heater of the array having a nominal sheet resistance, a first nominal length and a first nominal width, the method includes (a) providing a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length; (b) measuring a resistance of the first resistive heater; (c) measuring a resistance of the first configuration test resistor; and (d) determining the actual sheet resistance and the actual length of the first resistive heater based on the measured resistances of the first resistive heater and the first configuration test resistor.

Method of characterizing array of resistive heaters

A printhead module includes a substrate, a plurality of drop ejector arrays, and electronic circuitry. The substrate includes a butting edge extending in a first direction along the substrate. The plurality of drop ejector arrays extends substantially parallel to the butting edge of the substrate with a first drop ejector array of the plurality of drop ejector arrays being closest to the butting edge of the substrate. A portion of the electronic circuitry is disposed between the first drop ejector array and the butting edge of the substrate.

Buttable printhead module and pagewide printhead

A liquid ejector includes a structure defining a chamber. The chamber includes a first surface and a second surface. The first surface includes a nozzle orifice. A drop forming mechanism is located on the second surface of the chamber opposite the nozzle orifice. A first liquid feed channel and a second liquid feed channel are in fluid communication with the chamber. A first segment of a segmented liquid inlet is in fluid communication with the first liquid feed channel and a second segment of the segmented liquid inlet is in fluid communication with the second liquid feed channel.

Dual feed liquid drop ejector

A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.

Fluid-ejecting device with simplified connectivity

Methods and apparatus provide for automatic fluid ejector alignment and performance evaluation and modification in one or multiple planes. A fluid ejector fires a drop through a drop detection module. A signal indicating drop presence or absence is sent to a computer. The computer analyzes the data, and makes a compensation determination of a preferred method of using the fluid ejector. The compensation determination may include electronically modifying the image data to be printed, physically manipulating the fluid ejector, completely skipping the fluid ejector during printing operations, or in some other way modifying the fluid ejector or image data such that apparent printed image error due to fluid ejector alignment or performance error is reduced.

Methods and apparatus for an automatic fluid ejector alignment and performance system

Systems and methods for reducing or preventing fluid misplacement by a fluid-ejecting head having a plurality of fluid ejectors are disclosed. Each of the fluid ejectors has a transducer activated in some sequence in response to input signals to eject a fluid droplet from the fluid ejector. The systems comprise electronics which integrate delay time buffers into the sequence of fluid ejector firing electronics. Adjusting the delay time buffers will adjust the angle between printed data (e.g. vertical lines) and the direction of the head motion. Several methods for determining the delay times that produce the optimal fluid placement are disclosed.

Electronic tilt adjustment in fluid-jet fluid ejecting heads

A method and Apparatus for protection of semiconductor micromechanical devices that use circuits with dynamic logic addressing is disclosed. In one exemplary embodiment of the invention, a fail-safe circuit is provided for an ink jet print head integrated circuit which prevents a catastrophic consequence of the dynamic logic addressed integrated circuit losing its charge.

Fail-safe circuit for dynamic smartpower integrated circuits

A programmable circuit and method of programming that provide an easily fabricated circuit that does not require specialize manufacturing or packaging techniques. The circuit provides for temporarily setting the circuit outputs which can then be used for testing. The circuit also provides for permanently setting the output by applying sufficient voltage and current to the transistor that permanent spiking of the metallized contact layer through the junction occurs.

Growing community of inventors

Rochester, NY, United States of America

Christopher R Morton