Dell Products Inc.

Christopher Michael Helberg

Travis Christian North

Austin Michael Shelnutt

Shawn Paul Hoss

Cyril Adair Keilers

Edmond Ira Bailey

James Don Curlee

Edward Douglas Knapton

Deeder M Aurongzeb

Steven Embleton

David Gary Methven

Derric Christopher Hobbs

Chin-An Huang

Steven J Zielnicki

Timothy Ray Graham

Andrew Thomas Sultenfuss

Tyler B Duncan

David Michael Meyers

Thomas Alexander Shows

Philip Joseph Grossmann

Eric Sendelbach

Steven Michael Christensen

Tifenn M Boisard

Duen Hsing Hsieh

Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.

Liquid cooling module for an information handling system

A modular desktop computing system includes a display stand chassis having a display stand base, a display stand support member extending from the display stand base and including a display device mounting subsystem, and a display stand cover removeably coupled to the display stand support member to define a computing module housing between the display stand support member and the display stand cover. A display device is removeably mounted to the display device mounting subsystem. A computing module is located in the computing module housing. The computing module includes a computing module chassis removeably positioned in the computing module housing and housing: a processing system coupled to the display device, and a memory system coupled to the processing system. The memory system includes instructions that, when executed by the processing system, cause the processing system to provide for the display of images on the display device.

Configurable all-in-one modular desktop computing system

A thermal module assembly, comprising: a computing expansion card; a thermal interface material (TIM) positioned on a surface of the computing expansion card; a thermal plate; and a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier include a first end positioned opposite to a second end, wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide an uniform pressure between the thermal plate, the TIM material, and the computing expansion card.

Thermal module assembly for a computing expansion card port of an information handling system

A heat dissipation wall system includes a base wall having an outer surface, a plurality of side walls extending approximately perpendicularly from the base wall to define a component housing between the base wall and the side walls, and a plurality of heat dissipation channels defined by the base wall and extending into the base wall from the outer surface. Each of the heat dissipation channels includes a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing.

Heat dissipation wall system

Methods, systems, and computer programs encoded on computer storage medium, for detecting, across a resistive sense circuit proximate to a venting system of an IHS, a first voltage at a first time, wherein the first voltage includes a state-steady voltage and a nominal voltage; comparing the first voltage to a voltage threshold, and determining that the first voltage is less than or equal to the voltage threshold and in response, maintaining a power state of the IHS; detecting, across the resistive sense circuit, a second voltage at a second time after the first time, wherein the second voltage includes the steady-state voltage and a low-voltage; comparing the second voltage to the voltage threshold, and determining that the second voltage is greater than the threshold voltage, and in response preparing a computer-implemented response to mitigate damage to the IHS from liquid contacting one or more computing components of the IHS.

System and method for mitigating liquid damage to an information handling system

An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

Expansion module system

A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

Rack information handling system having modular liquid distribution (MLD) conduits

An information handling system includes a triangular chassis and a plurality of antennas that provide optimized coverage in all directions around the triangular chassis. An antenna may be operated from each vertex of the triangular shaped base chassis. Alternatively, an antenna may be operated from each of three main side surfaces of the triangular shaped base chassis. One or more of the antennas can be selected for communication based on the ability to communicate with external network components. Disclosed systems provide omnidirectional coverage around the triangular chassis while minimizing the effects of shadowing caused by abase chassis.

Antenna method and apparatus

A forced convection system includes a chassis defining a chassis housing and including an outer surface opposite the chassis housing. A forced convection device channel is defined by the chassis adjacent the outer surface and opposite the chassis housing. A heat dissipation structure extends from the chassis adjacent the outer surface, opposite the chassis housing, and adjacent the forced convection device channel. A first heat producing device is located in the chassis housing and engages the chassis immediately opposite the heat dissipation structure to allow the chassis and the heat dissipation structure to conduct heat generated by the first heat producing device. A forced convection device is located in the forced convection device channel, and produces a forced convective airflow past the heat dissipation structure to dissipate the heat generated by the first heat producing device and conducted by the chassis and the heat dissipation structure.

Forced convection cooling system

A method of assembling a direct-contact, liquid-cooled (DL) Rack Information Handling System (RIHS) includes inserting a leak containment barrier in a node enclosure provisioned with heat-generating functional components. The method also includes attaching a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. A trough of the leak containment barrier underlays a portion of the system of conduits of an LC node and forms a drain path to a drain port of the node enclosure. The method further includes mounting the LC node insertably received in one node-receiving slot having a rear section configured for blind mating of the node inlet and outlet ports to a node-receiving liquid inlet port and a node-receiving liquid outlet port positioned to be inwardly facing to the couplings of the LC node.

Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation

An externally mounted component cooling system includes a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing. An air inlet is defined by the chassis and extends through the chassis from the outer surface to the chassis housing. At least one external component mounting feature is included on the outer surface of the chassis adjacent the air inlet. An external component is coupled to the at least one external component mounting feature. A forced convection device is located in the chassis housing and is configured to generate an airflow through chassis housing. The generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component.

Externally mounted component cooling system

A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Liquid cooling of rack information handling system with a plurality of liquid flow paths that enable continued cooling of liquid cooled nodes when one flow path is disrupted

A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.

Chassis outer surface supplemental passive cooling system

A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.

Growing community of inventors

Austin, TX, United States of America

Christopher Michael Helberg