General Electric Company

Sabic Innovative Plastics IP B.v.

Christopher Michael Eastman

Stanton Earl Weaver, Jr

Paul Dean Sybert

Kevin Matthew Durocher

James Edward Pickett

Hendrik Pieter Jacobus De Bock

Shakti Singh Chauhan

David Mulford Shaddock

Tao Deng

Jon Michael Malinoski

Dalong Zhong

Glen David Merfeld

Sumeet Jain

Rainer Koeniger

Wenwu Zhang

Michael Todd Luttrell

Jason Testa

Deng Tao

Jr Stanton Earl Weaver

A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.

Heat exchange assembly and methods of assembling same

A thermosetting polymer material capable of being used in powder coatings. The thermosetting polymer material includes at least one hydroxyl functional aliphatic polycarbonates that is formulated and crosslinked with isocyanates to yield a thermoset organic coating material. These materials provide improved weatherability as compared to prior art powder coating materials while also being less expensive than prior art materials utilizing fluorinated polymers.

Aliphatic polycarbonates for use in thermosetting powder coatings

An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.

Article including thermal interface element and method of preparation

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Ballston Lake, NY, United States of America

Christopher Michael Eastman