Primo1d

Christopher Mackanic

Emmanuel Arene

Robin Lethiecq

Pavina Nguyen

Gianfranco Andia Vera

Delphine Rolland

A system for inserting a wire into a semiconductor chip system includes positioning members for deploying and moving a length of the wire between a first end and a second end of a workspace. A handling device of the system is configured to handle the semiconductor chip, and is capable of placing the chip in an insertion position in which a groove of the chip is placed opposite the wire. A positioning member of the system is configured to arrange a longitudinal section of the wire along the groove, in forced abutment against a pad of the chip made of a bonding material having a melting point. A heating member of the system is configured to heat a zone comprising the pad to a processing temperature above the melting point to melt the pad and provoke insertion of the wire into the groove.

System for inserting a wire into a semiconductor chip

A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.

Method for inserting a wire into a groove of a semiconductor chip

A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.

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Le Versoud, France

Christopher Mackanic