Motorola Corporation

Christopher M Scanlan

Guillermo L Romero

Carl J Raleigh

David M Gilbert

An electronic component (10) has an electrically insulating substrate (20) that is encapsulated with an electrically conductive material (15) to provide thermal dissipation for the electronic component (10). The electrically insulating substrate (20) has cavities (21-24) that are either completely filled with an electrically conductive material (15) or are partially filled to provide recesses (26-27) for electronic devices (30,31). The electronic devices (30,31) are electrically coupled to the leads (60-63) of the electronic component (10) using either wire bonds (70) or metallic depositions (55-57).

Electronic component

An assembly substrate includes a substrate (11, 31, 41), a composite layer (12, 32, 42) overlying the substrate (11, 31, 41), and an electrically conductive layer (13, 33, 43) overlying the composite layer (12, 32, 42). The composite layer (12, 32, 42) includes a first material having an as-deposited tetragonal crystal structure and a second material. The second material in the composite layer (12, 32, 42) reduces the susceptibility of the composite layer (12, 32, 42) to fracture under stress.

Assembly substrate and method of making

A hybrid multi-chip module includes semiconductor chips (27, 31) bonded to a base plate (24). The base plate includes a substrate (11) having two surfaces (12, 13) and a conductive material (16) molded on the two surfaces (12, 13). A coefficient of thermal expansion (CTE) mismatch between the substrate (11) and the conductive material (16) at the first surface (12) is balanced by a similar, but opposite, CTE mismatch between the substrate (11) and the conductive material (16) at the second surface (13). The CTE mismatch balance across the base plate (24) produces a base plate (24) having a substantially planar form at high temperatures.

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Phoenix, AZ, United States of America

Christopher M Scanlan