Intel Corporation

Christopher M Moore

Juha Paavola

Prakash Kurma Raju

Gustavo Fricke

Jeff Ku

Mark Charles Carbone

Vivek Paranjape

Mikko Antero Makinen

Kathiravan D

Hari Shanker Thakur

Ritu Bawa

Prasanna Pichumani

Gavin Sung

Daniel J Ragland

Arnab Sen

Justin Michael Huttula

Hua Yang

Kannan G Raja

Gokul V Subramaniam

Lance Lin

Jason Y Jiang

Baomin Liu

Xiyong Tian

Columbia Mishra

Jia Yan Go

Ruander Cardenas

Twan Sing Loo

Evan Piotr Kuklinski

Saara Kamppari-Miller

Gerry Juan

Javed Shaikh

Chin Kung Goh

Nehakausar Shaikh Ramjan Pinjari

Rand Lenroot

Khal Ern See

Sammi Wy Liu

Nehakausar Pinjari

Chun-Ting Liu

Mikko Makinen

Luis Diego Jimenez Sanchez

Monica Maria Conejo Herrera

Curtis Koepsell

Shih Wei Nien

George Baoci Sun

Edward Morton Burdick

Juha Tapani Paavola

Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.

Cooling systems with heat pipes for electronic devices

Metal is extruded through a feeder plate and an extrusion die to form a heat pipe component that includes a length of pipe and a flange extending outward from the pipe along the length of the pipe. A section of the flange is removed from the extruded heat pipe component, the pipe is sealed and compressed to reduce its thickness and form a heat pipe element for a computing system.

Extruded heat pipe

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Portable computer

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

Vapor chamber and means of attachment

Growing community of inventors

Hillsboro, OR, United States of America

Christopher M Moore