Advanced Micro Devices Corporation

Dell Products Inc.

Dell USA L P

Christopher M Jaggers

Matthew C Grossman

Steve Capezza

Christopher Janak

David A McAfee

Christopher Cavello

Carlos Santillana

Jefferson Blake West

Robert L McMahan

Ali Akbar Merrikh

Robert Edward Radke

Christopher M Helberg

Damon W Broder

Michael Garel

Paul G Hughes

Michael J Austin

Jay Matthew Zill

Sukesh Shenoy

Mustansir M Pratapgarhwala

Chris Janak

Swagata P Kalve

Cassius Joseph Mullen

Andrew J McNamara

David William Grunow

Nicholas Poteracki

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

Component cooler for a computing device

A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.

Secondary external cooling for mobile computing devices

A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.

Chassis as a common cooling solution for die packages

An apparatus for a common cooling solution for multiple packages of a common height, including: a first die package; a second die package having a same height as the first die package; and a cooling element thermally coupled to the first die package and the second die package by a planar surface of the cooling element.

Common cooling solution for multiple packages

A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.

Optical bridge interconnect unit for adjacent processors

A thermal management system includes an integrated circuit having an active side including a control circuit and a backside including a first set of electrodes distributed across the backside. The thermal management system includes a heat exchanger having a surface including a second set of electrodes. The thermal management system includes a thermal interface material including thermally conductive particles suspended in a fluid. The thermal interface material is disposed between the backside of the integrated circuit and the surface of the heat exchanger. The control circuit is configured to apply an electric field to the thermal interface material using a first electrode of the first set of electrodes and a second electrode of the second set of electrodes to excite at least some of the thermally conductive particles between the first electrode and the second electrode.

Thermal management using variation of thermal resistance of thermal interface

Housing of an electronic device

Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.

Modular thermal solution for high-performance processors

Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.

Multi-compartment computing device with shared cooling device

A docking station for a wireless communications device includes a support structure that includes a cradle for the wireless telephone. The docking station includes a switch, sensor or other detection mechanism that detects when the wireless communication device is docked. When the wireless communication device is docked, the detection mechanism sends a signal to the wireless communication device. A set of instructions stored in the processor determines which display and which input to use, depending on whether or not the signal is received from the detection mechanism. Embodiments include a display, USB hub, and modem in the docking station. Another embodiment includes a USB connector in the wireless communication device. Finally, an embodiment includes a docking station with equivalent features for a cellular telephone or Personal Digital Assistant (PDA).

Docking station for wireless communication device

A docking station for a wireless communication device, such as a cellular telephone. The docking station includes a cradle for the cellular phone and comprises an associated LCD that enhances the video display capabilities of the cellular telephone. When docked, the cellular telephone draws power from a voltage supply provided by the docking station. While the cellular telephone is docked, a charging circuit recharges the cellular telephone battery. The docking station may be disconnected from an AC outlet so that the docked cellular telephone retains both enhanced display capabilities, which prove to be highly desirable for applications such as Internet access, as well as its inherent portability. Even in the portable mode, where the docking station is disconnected from the AC outlet, the docking station recharges the cellular telephone battery.

Portable wireless communication device docking system

A modular bay enclosure removable card method and system. The method and system include a modular bay having a removable-card connector and a removable card. In one embodiment, the removable-card connector is a mini-Peripheral Component Interconnect connector, and the removable card is a mini-Peripheral Component Interconnect card.

Modular bay enclosure removable card method and system

A portable projection lock receiver ( ) includes a shackle portion ( ) adapted to fit through an opening ( ) on the device to be secured. The shackle portion ( ) of the projection lock receiver ( ) has an open section ( ) and a first opening ( ) formed at one end. A closure member ( ) associated with the shackle includes a second opening ( ) which may be aligned with the first opening ( ). In this aligned position, the closure member ( ) closes the shackle open section ( ) and the two aligned openings ( ) together form a projection lock receptacle. This projection lock receptacle is conformed to receive and retain a suitably sized projection portion of a projection lock.

Growing community of inventors

Austin, TX, United States of America

Christopher M Jaggers