Raytheon Company

Ball Aerospace & Technologies Corp.

Christopher Lynn Mears

John J Drab

John L Vampola

Sean P Kilcoyne

Richard H Wyles

Chad W Fulk

David A Dorn

Alex Harwit

Robert Hadley Philbrick

Donald F King

Barry M Starr

Peter C Roberts

Morley M Blouke

Theresa J Axenson

Aspects and examples described herein provide a hybrid imaging sensor chip assembly for reducing undesired radiative transfer between a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC) and an optical detector, and methods of manufacturing a hybrid imaging sensor chip assembly. In one example, a hybrid imaging sensor chip assembly includes an optical detector configured to collect electromagnetic radiation incident thereon, a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC), and a radiation-shielding wafer interposed between the optical detector and the CMOS ROIC, the radiation-shielding wafer including a plurality of through wafer vias (TWVs) electrically coupled to the optical detector and the CMOS ROIC, the radiation-shielding wafer being positioned to prevent radiative transfer between the CMOS ROIC and the optical detector.

Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit

A method for sensing using a multi-band photovoltaic detector, the method including biasing the photovoltaic detector using a bias voltage at a mid-point of a detector substrate bias voltage range, selecting a first band of the multi-band photovoltaic detector, sensing a first current from a first diode of the multi-band photovoltaic detector, the first diode being associated with the first band, selecting a second band of the multi-band photovoltaic detector; and sensing a second current from a second diode of the multi-band photovoltaic detector, the second diode being associated with the second band.

Multi-color superpixel operational constructs for focal plane arrays

The present invention relates to imaging systems that generally include at least a first substrate, on which a charge coupled device imaging sensor array is formed, and a second substrate on which readout circuitry is formed. Information related to the amount of light incident on pixels included in the imaging sensor array is passed to the readout circuitry as a voltage signal over an interconnection between the imaging sensor array and the readout circuitry. Accordingly, the readout circuitry may sample the output of the imaging sensor array multiple times. The system allows different processes to be used for forming the imaging sensor array and the readout circuitry, while also supporting multiple samples of information provided by the imaging sensor array.

Hybrid imager

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Boulder, CO, United States of America

Christopher Lynn Mears