Cytec Technology Corporation

Christopher Lee Bongiovanni

Jack D Boyd

Christopher Pederson

Jack Douglas Boyd

Systems and methods for the fabrication of prepregs possessing enhanced ability for the removal of gases from within prepregs and prepreg layups prior to and/or during at least a portion of consolidation and cure process to form composite structures are disclosed. In certain embodiments, perforations of selected configurations may be introduced into the prepregs prior to, during, and after layup. The perforations provide routes for gases trapped within and between the perforated prepregs and prepreg lay-ups to escape during consolidation and cure process, reducing the residual porosity within the resulting composite. For example, composites having residual porosities less than 10 vol. %, on the basis of the volume of the composite, may be achieved in this manner.

Prepregs with improved processing

The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.

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Anaheim, CA, United States of America

Christopher Lee Bongiovanni