Motorola Corporation

Christopher Lee Becher

Richard Lee Mangold

Ovidiu Neiconi

Douglas W Hendricks

David H Rubin

Thomas P Kirby

John Patrick Hunt

Christopher John Keane

A solder printing apparatus (40) for use within a solder printer (34) includes a vision and alignment mechanism (44), a steering mechanism (46), a vacuum conveyer (48), and a tension roller assembly (42). The vision and alignment mechanism (44) controls the position of the flexible tape (10) and sends a signal to the steering mechanism (46). The steering mechanism (46) adjusts the position of the flexible tape (10) in response to receiving the signal from the vision and alignment mechanism (44). The vacuum conveyer (48) holds and advances the flexible tape (10). The tension roller assembly (42) maintains tension in the flexible tape (10).

Solder printing apparatus

An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first and second motors (502, 503), a vacuum source, a plenum (110), and first and second elevators (404, 405). The pallets carry the substrate, while the first and second tracks guide the pallets. The first motor is used for driving a pallet in a first direction on the first track, while the second motor is used for driving a pallet in a direction opposite to the first direction on the second track. The plenum is coupled to the vacuum source and at least one pallet for applying adhering forces to the substrate. The first and second elevators are used for transferring a pallet between the first and second tracks.

Apparatus for indexing and affixing components to a substrate

An apparatus (400) enclosing a portion of a substrate (401) is used for affixing at least one component to a corresponding circuit of the substrate when a manufacturing line (800) ceases to operate. The apparatus includes a conveyor (400), heating elements (102), and a controller (816) for controlling operation of the apparatus (400). The conveyor is used for indexing the substrate periodically through the apparatus. The heating elements are used for dividing the portion of the substrate enclosed by the apparatus into controllable temperature zones (902). The controller is adapted to cause each of the plurality of heating elements to dynamically adjust the temperature of each of the controllable temperature zones upon the indexing process of the manufacturing line (800) ceasing to operate, until at least one component of each circuit enclosed by the apparatus has been adequately affixed to its corresponding circuit.

Method and apparatus for affixing components to a substrate when a

According to the present invention, a screen printer (200) selectively applies solder paste to multiple types of printed circuit boards. The screen printer (200) includes mobile placement equipment (210), which receives and transports the boards, and application equipment, which includes first and second stencils (225), frames for holding the stencils (225) in fixed positions, and an applicator (415) for applying solder paste to a board through either the first or second stencil (225). A controller (215) determines the type of a board received by the mobile placement equipment (210), then, when the board is of a first type, directs the mobile placement equipment (210) to a location aligned with the first stencil. When the board is of a second type, the mobile placement equipment (210) is directed to a location aligned with the second stencil.

Apparatus for selectively applying solder paste to multiple types of

A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).

Method and apparatus for selectively applying solder paste to multiple

A robotic placement device (FIG. 1) comprises a programmable end-effector (200) for picking and placing component parts. The programmable end-effector (200) comprises a cylinder (201) having a piston (202) including a first (203) and second (208) shafts coupled together. The first shaft (203) of the piston is larger than the second shaft (208). A controller (102) controls a pressure applied to the cylinder (201) and the piston (202) including the first (203) and second (208) shafts of the programmable end-effector (200) establishes a predetermined placement force at the programmable end-effector (200) while placing component parts. A control circuit 118 senses the pressure and in response thereto generates a signal. A processor 108 coupled to the controller (102) processes the signal and in response thereto varying the pressure for maintaining a substantially constant placement force at the programmable end-effector (200) while the programmable end-effector (200) moves vertically.

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Boynton Beach, FL, United States of America

Christopher Lee Becher