Texas Instruments Corporation

Christopher L Schutte

George T Wallace

Prakash Lakshmikanthan

David A Stark

A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.

Permeated grooving in CMP polishing pads

A semiconductor wafer handler comprises a ring () attached to a hub () by a plurality of spokes (). Vacuum is applied to the surface of the semiconductor wafer through orifices () containing in the ring (). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices () contained in the spokes ().

Semiconductor wafer handler

According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface adapted to couple a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is adapted to couple an inner portion of the polishing pad to the platen. According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface coupling a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is coupling an inner portion of the polishing pad to the platen.

Chemical mechanical polishing system

A semiconductor wafer handler comprises a ring ( ) attached to a hub ( ) by a plurality of spokes ( ). Vacuum is applied to the surface of the semiconductor wafer through orifices ( ) containing in the ring ( ). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices ( ) contained in the spokes ( ).

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Richardson, TX, United States of America

Christopher L Schutte