Harris Corporation

Other

Christopher L Rexer

John M Neilson

Louise E Skurkey

Linda Susan Brush

John Lawrence Benjamin

Richard Douglas Stokes

Christopher Boguslaw Kocon

Thomas E Grebs

Carl Franklin Wheatley, Jr

Frederick P Jones

Anup Bhalla

Joseph A Yedinak

Frank Stensney

Christopher Boguslow Kocon

Christopher Michael Scarba

Mark L Rineheimer

A method of fabricating a MOS-gated semiconductor device in which arsenic dopant is implanted through a mask to form a first layer, boron dopant is implanted through the mask to form a second layer deeper than the first layer, and in which a single diffusion step diffuses the implanted arsenic and the implanted boron at the same time to form a P+ body region with an N+ source region therein and a P type channel region.

Method of making a MOS-gated semiconductor device with a single diffusion

A method of fabricating a UMOS semiconductor device includes a blanket implant of an N type dopant into a surface of a substrate (for forming source regions), a high energy implant of a P type dopant into the substrate (for forming body regions), an etch through a hard mask to form trenches and mesas (each of the mesas having a source region at its top and a body region below), and concurrently (i) providing a gate dielectric on the sidewalls of the trenches and (ii) redistributing the dopants so that the body regions extend deeper into the substrate beneath the centers of the mesas than adjacent the walls of the trenches. Contact windows are etched in the mesas to allow electrical contact with the source regions and the body regions. The initial implant of P type dopant may be a blanket implant or an implant through a mask which concentrates the P type dopant in the centers of the mesas.

Method of fabricating UMOS semiconductor devices using a self-aligned,

A gate electrode control structure of an MOS-gated semiconductor device includes four doped regions including a first (source) region forming a first P-N junction with an enclosing composite region comprising a second, lightly doped (channel) region wholly enclosing a third heavily doped (body) region partly enclosing the first region, and a fourth (drain) region forming a P-N junction with the third region. The gate electrode control structure is fabricated using known gate electrode self-alignment doping processes but wherein, in the process for forming the third heavily doped region, a spacer layer is provided on the gate electrode for defining a spacing between the third region and the channel region with an improved degree of precision.

Method of making MOS-gated semiconductor devices

A MOS-gated semiconductor device may be manufactured by a process in which the neck region of the device is doped through a previously deposited polysilicon gate. In the method of the present invention, the dopant in the neck region of the device is not subjected to the same temperature history as the body dopant, thereby providing means to increase the ruggedness of the device and providing means by which the threshold voltage of the device may be controlled.

Method of doping a JFET region in a MOS-gated semiconductor device

In a power FET composed of a substrate having upper and lower surfaces, the FET providing a current flow path between the upper and lower surfaces, and the FET having a plurality of drain regions extending to the substrate upper surface and an insulated gate electrode disposed on the upper surface, the improvement wherein said drain regions are disposed in a hexagonal lattice pattern, and said gate electrode comprises: a plurality of gate segments each covering a respective drain region; and a plurality of connecting segments each connecting together three of said gate segments.

Power FET with gate segments covering drain regions disposed in a

Semiconductor devices with elongated well regions in a stripe geometry pattern include uniformly sized source exclude areas that are longitudinally offset with respect to source exclude areas in adjacent well regions. The uniformity of the current density in neck regions is increased, thereby increasing the current carrying capability of the device.

Device and method for improving current carrying capability in a

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Mountaintop, PA, United States of America

Christopher L Rexer