Qualcomm Incorporated

Christopher L Medrano

Jon James Anderson

Ronald Alton

Hee Jun Park

Young Hoon Kang

Praveen Kumar Chidambaram

Vijay Raman

Amit Mahajan

Brian J Salsbery

Srinivasan Rajagopalan

Unnikrishnan Vadakkanmaruveedu

Vinay Mitter

Vasanth Kumar Ramkumar

Michael Kevin Spartz

Ankur Jain

Jeffrey A Niemann

Amy Derbyshire

Anil Vootukuru

Shiju Abraham Mathew

David Cheuk Wai Ng

Xin Qi

Ronald Frank Alton

Michael K Spartz

A temperature of a component within the portable computing device (PCD) may be monitored along with a parameter associated with the temperature. The parameter associated with temperature may be an operating frequency, transmission power, or a data flow rate. It is determined if the temperature has exceeded a threshold value. If the temperature has exceeded the threshold value, then the temperature is compared with a temperature set point and a first error value is then calculated based on the comparison. Next, a first optimum value of the parameter is determined based on the first error value. If the temperature is below or equal to the threshold value, then a present value of the parameter is compared with a desired threshold for the parameter and a second error value is calculated based on the comparison. A second optimum value of the parameter may be determined based on the second error value.

Method and system for optimizing performance of a PCD while mitigating thermal generation

Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip ('SoC') are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service ('QoS') by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

Energy efficiency aware thermal management in a multi-processor system on a chip

Energy efficiency aware thermal management in a multi-processor system on a chip based on monitored processing component current draw

Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.

Thermal management in a computing device based on workload detection

Various embodiments of methods and systems for optimizing processing performance in a multi-functional portable computing device ('PCD') are disclosed. Depending on how the PCD is being used, the temperature limit associated with the touch temperature of the PCD may be variable. As such, a preset and fixed touch temperature limit based on a 'worst use case' scenario can unnecessarily limit the quality of service (&#x201c;QoS&#x201d;) provided to a user under different use case scenarios. Accordingly, embodiments of the systems and methods define and recognize different device definitions for the PCD which are each associated with certain use cases and each dictate different temperature thresholds or limits subject to which the PCD may run.

System and method for thermal management in a multi-functional portable computing device

Methods, systems, and devices are described for managing power of a user equipment (UE). A UE modem may determine the state of charge of the battery to determine that the battery is in one of two or more charge state levels, and may invoke one or more modem power saving modes based on the charge state level. Power saving modes may include, for example, reducing a number of available receive chains in a UE, initiating a time delay between one or more frequency scan requests performed by the UE, reducing a rate of neighbor search requests performed by the UE, providing a buffer status report (BSR) parameter that indicates a reduced amount of buffer data relative to an actual amount of buffer data for the UE, and/or adjusting a maximum transmit power level for an uplink channel.

Methods and apparatus for reducing modem power based on a present state of charge of battery

A system and method for reducing heat in a portable computing device includes clocking a processor such that it is provided with a full frequency over time tto t. A timer is set to trigger a forced power collapse ('FPC') that removes all power to the processor from time tto time t. At time t, the processor may be awakened such that it can resume processing at the full frequency. Advantageously, during the FPC, no leakage power ('P') is consumed by the processor between tand t. The result is that the processor averages the same processing efficiency over time tto tas it otherwise would have if a reduced frequency had been provided to it. However, because no Pwas consumed during the FPC, the generation of heat between time tand tthat is related to Pis avoided.

Method and system for reducing thermal load by forced power collapse

A method and system for thermal mitigation in a personal computing device is disclosed. A signal associated with an electronic element in the portable computing device is monitored. A thermal condition indicating excessive heat production is determined in response to the monitored signal. An action to mitigate heat production in the portable computing device may be performed in response to the thermal condition.

Sensorless detection and management of thermal loading in a multi-processor wireless device

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Boulder, CO, United States of America

Christopher L Medrano