Palo Alto Research Center Inc.

Xerox Corporation

Other

Christopher L Chua

Noble Marshall Johnson

David Kirtland Fork

Zhihong Yang

Eric Peeters

John E Northrup

Thomas Wunderer

Decai Sun

Koenraad F Van Schuylenbergh

Eugene Michael Chow

David P Bour

Jeng Ping Lu

Patrick Yasuo Maeda

Ashish V Pattekar

Mark Teepe

Qian Wang

Clifford F Knollenberg

David Kalman Biegelsen

Michael A Kneissl

Rene A Lujan

Brent Shawhan Krusor

Donald Leonard Smith

Bowen Cheng

Linda T Romano

Gregory Lewis Whiting

Dirk De Bruyker

Scott J Limb

Francesco Lemmi

Andre Strittmatter

Yu Wang

Jengping Lu

Philip D Floyd

Peter Kiesel

Robert L Thornton

Michel A Rosa

Warren Bruce Jackson

Ping Mei

Thomas L Paoli

Joerg Martini

Norine E Chang

David W Treat

Fatemeh Nazly Pirmoradi

Michael G Hack

Robert Anthony Street

Carolyn Patricia Moorlag

Thomas Hantschel

Sean Roark Garner

James B Boyce

Ross D Bringans

Eugene S Beh

Anne Plochowietz

Sylvia Joan Smullin

Jacob N Chamoun

Jamie Kalb

Joel A Kubby

William S Wong

Jurgen Hans Daniel

Michael L Chabinyc

Sourobh Raychaudhuri

Alex T Tran

Julie A Bert

Kyle Arakaki

Patrick G Kim

Suk Choi

Joseph Lee

Steven Neltner

Raj B Apte

Timothy D Stowe

Alan G Bell

Alex N Hegyi

Scott Eugene Solberg

Jack A Walker

Harry Jonathan McIntyre

Eric Cocker

Elif Karatay

JengPing Lu

Erica Ronchetto

Chinnwen Shih

Emily Coker

Yan Yan Yang

Koenraed F Van Schuylenbergh

David K Biegelson

Rose M Wood

Michael A Kniessl

A microspring includes a film stack having a base disposed on a build plane and a spring member extending from the base. The film stack includes a compressive layer, a substantially stress-free layer, and a tensile layer. The film stack is formed of one or more materials that become superconducting below 140 K. A stress gradient in the film stack causes the spring member to curl away from the build plane of the base.

Stress engineered microspring for cryogenic superconducting circuits

A method of manufacturing superconductor structures includes depositing a release film on a substrate, forming a stack of films comprising an elastic material and a superconductor film, releasing a portion of the elastic material by selective removal of the release film so that portion lifts out of the substrate plane to form elastic springs. A method of manufacturing superconductor structures includes depositing a release film on a substrate, forming a stack of films comprising at least an elastic material, releasing a portion of the elastic material so that portion lifts out of a plane of the substrate to form elastic springs, and coating the elastic springs with a superconductor film.

Superconducting stress-engineered micro-fabricated springs

An apparatus comprises a frangible structure coupled or integral to at least a portion of the apparatus and a triggerable mechanism disposed at or proximate the frangible structure. The triggerable mechanism is configured to break the frangible structure in response to a trigger signal. A containment structure is disposed on or over at least a portion of the frangible structure. The containment structure is configured to allow at least the portion of the frangible structure to deform or change shape in response to breaking of the frangible structure while keeping substantially all fragments of at least the portion of the broken frangible structure together.

Triggerable mechanisms and fragment containment arrangements for self-destructing frangible structures and sealed vessels

A computer adapted to convert images into raw data can provide the raw data to a control interface adapted to transmit the raw data with timing information to an electronic driver circuit. The electronic driver circuit can convert the raw data with the timing information provided by a control interface into regulated current signals provided to the semiconductor laser array at 300 dpi and higher. The semiconductor array can convert the current signals into light to illuminate an imaging member. The laser array can comprise vertical cavity surface emitting lasers providing imaging greater than 300 dpi. Each semiconductor laser can operate at 50 mW or greater.

System for electronically controlling and driving independently addressable semiconductor lasers

An apparatus includes a structure comprising a predetermined breakable region and a mechanical actuator disposed at or proximate the predetermined breakable region. The mechanical actuator comprises an impact member coupled to a spring arrangement, and a restraint member operably coupled to the spring arrangement. A trigger source is operably coupled to an electrical power source. The trigger source, in response to receiving current from the electrical power source, is configured to release or break the restraint member so as to allow the spring arrangement to forcibly move the impact member into contact with, and break, the predetermined breakable region.

Mechanical triggers and triggering methods for self-destructing frangible structures and sealed vessels

An electronic assembly and methods of making the assembly are disclosed. The electronic assembly includes a substrate with an elastic member having an intrinsic stress profile. The elastic member has an anchor portion on the surface of the substrate; and a free end biased away from the substrate via the intrinsic stress profile to form an out of plane structure. The substrate includes one or more spacers on the substrate. The electronic assembly includes a chip comprising contact pads. The out of plane structure on the substrate touches corresponding contact pads on the chip, and the spacers on the substrate touch the chip forming a gap between the substrate and the chip.

Spacers formed on a substrate with etched micro-springs

A computer-implemented system and method for object tracking via identifier-tracker pairings is provided. At least one tracker-identifier pair is maintained. The tracker is associated with an entity, including a person or object. The identifier is accessed to locate the entity. The tracker associated with the identifier is identified and a location of the entity is determined based on a location of the tracker. The location of the entity is provided to the user.

Computer-implemented system and method for object tracking via identifier-tracker pairings

A laser imager for a printing system, comprising a plurality of independently addressable surface emitting lasers arranged in a linear array on a common substrate chip and including a common cathode and a dedicated control channel associated with an address trace line for each laser of the plurality of independently addressable surface emitting lasers, and optical elements arranged in a linear lens array configured to capture and focus light from the plurality of independently addressable surface emitting lasers onto a imaging member, wherein the plurality of independently addressable surface emitting lasers arranged in a linear array and the optical elements arranged in a linear lens array operate together to image the imaging member.

Semiconductor array imager for printing systems

A printing system for producing at least one three dimensional (3D) printed part is described. The printing system includes a deposition system configured to continuously deposit a layer onto a cylinder to outwardly extend a diameter of the cylinder, wherein the layer comprises a first pattern. The printing system also includes a rotating system configured to rotate the cylinder, and a control system configured to synchronize the deposition system with the cylinder.

Apparatus for continuous high-speed 3D printing

A method of providing high-speed three dimensional (3D) printing is described. The method includes producing at least one three dimensional (3D) printed part. Producing the 3D part includes continuously constructing to extend outwardly a diameter of a rotating cylindrical core via continuous deposition of a layer, and defining a first pattern in the continuously deposited layer corresponding to a cross-section of the at least one 3D printed part.

Method of continuous high-speed 3D printing

A self-destructing device includes a frangible substrate having at least one pre-weakened area. A heater is thermally coupled to the frangible substrate proximate to or at the pre-weakened area. When activated, the heater generates heat sufficient to initiate self-destruction of the frangible substrate by fractures that propagate from the pre-weakened area and cause the frangible substrate to break into many pieces.

Pre-conditioned self-destructing substrate

A structure can be provided for collimating light from a light source (e.g., vertical cavity surface emitting diodes). The structure can include at least one light source, a pit formed at an output of the at least one light source and a microbead formed in the pit. Microbeads can function as a lens to collimate light emitting from the at least one light source. The structure can provide by forming an array of VCSELs on a substrate, forming a pit in front of each VCSEL of the array of VCSELs, and assembling a microbead in each pit formed in front of each VCSEL. The microbeads can thereby function as lenses to collimate light emitted from the VCSELs.

Structure for collimating a light source

A release layer is formed on a surface of an integrated circuit wafer. The surface is passivated and includes metal contact materials. A stress-engineered film having an intrinsic stress profile is deposited over the release layer. The stress-engineered film is patterned and the release layer is undercut etched so that a released portion of the patterned stress-engineered film is released from the surface while leaving an anchor portion fixed to the surface. The intrinsic stress profile in the stress-engineered film biases the released portion away from the surface. The released portion is placed entirely within an area defined by the metal contact material.

Micro-fabricated, stress-engineered members formed on passivation layer of integrated circuit

A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mmper Gbps.

Chip-scale optoelectronic transceiver having microsprings on an interposer substrate

A method for providing high-speed three dimensional (3D) printing is provided. The method includes producing at least one three dimensional (3D) printed part. Producing the 3D part includes continuously constructing to extend outwardly a diameter of a rotating cylindrical core via continuous deposition of a layer, and defining a first pattern in the continuously deposited layer corresponding to a cross-section of the at least one 3D printed part.

Growing community of inventors

San Jose, CA, United States of America

Christopher L Chua