Micron Technology Incorporated

Round Rock Research, LLC

Micro Technology, Inc.

Christopher K Morzano

Wen Qian Li

Jeffrey P Wright

Greg A Blodgett

Brent Keeth

Charles L Ingalls

Sujeet V Ayyapureddi

Kevin J Ryan

Mark R Thomann

Alan John Wilson

Eric T Stubbs

Victor Wong

Jeffrey W Janzen

Christopher John Kawamura

Huy Thanh Vo

Sugato Mukherjee

Wen Li

A memory device includes multiple memory cells configured to store data. The memory device also includes multiple digit lines each configured to carry data to and from a respective memory cell. The memory device further includes multiple sense amplifiers each selectively coupled to respective digit lines and including first and second NMOS transistors and first and second gut nodes coupled to the first and second NMOS transistors, respectively. Each sense amplifier is configured to perform threshold compensation for the first and second NMOS transistors by storing respective voltages at the first and second gut nodes that are proportional to the respective threshold voltages of the first and second NMOS transistors. The sense amplifier also amplifies a differential voltage between the first and second gut nodes by charging the first gut node and discharging the second gut node based at least in part on respective charges of the digit lines.

Pre-sense gut node amplification in sense amplifier

Apparatuses and methods for storing redundancy repair information for memories are disclosed. An example apparatus includes a fuse array, a repair plane, and a decode logic and control circuit. The fuse array stores repair information that includes repair commands and load repair addresses. The load repair addresses include a respective repair address. The repair plane includes a block of memory and repair logic. The block of memory includes a plurality of redundant memory and the repair logic includes a plurality of repair blocks. Each repair block is associated with a respective one of the plurality of redundant memory and each repair block of the plurality of repair blocks stores a repair address. The decode logic and control circuit reads the repair information and decodes the repair commands, and loads repair addresses into the plurality of repair blocks based at least in part on the decoded repair commands.

Apparatuses and methods for storing redundancy repair information for memories

Apparatuses and methods for latching redundancy repair addresses at a memory are disclosed. An example apparatus includes block of memory including primary memory and a plurality of redundant memory units and repair logic. The repair logic including a plurality of repair blocks. A repair block of the plurality of repair blocks is configured to receive a set of repair address bits associated with a memory address for defective memory of the block of memory and to latch the set of repair address bits at a respective set of latches. The repair block is further configured to, in response to receipt of a memory access request corresponding to the set of repair address bits latched at the repair block, redirecting the memory access request to a redundant memory unit associated with the repair block.

Apparatuses and methods for latching redundancy repair addresses at a memory

Apparatuses and methods for latching redundancy repair addresses to avoid address bits overwritten at a repair block

Various embodiments include apparatuses having stacked devices and methods of forming dice stacks on an interface die. In one such apparatus, a dice stack includes at least a first die and a second die, and conductive paths coupling the first die and the second die to the common control die. In some embodiments, the conductive paths may be arranged to connect with circuitry on alternating dice of the stack. In other embodiments, a plurality of dice stacks may be arranged on a single interface die, and some or all of the dice may have interleaving conductive paths.

Apparatuses having stacked devices and methods of connecting dice stacks

Various embodiments include apparatuses, stacked devices and methods of forming dice stacks on an interface die. In one such apparatus, a dice stack includes at least a first die and a second die, and conductive paths coupling the first die and the second die to the common control die. In some embodiments, the conductive paths may be arranged to connect with circuitry on alternating dice of the stack. In other embodiments, a plurality of dice stacks may be arranged on a single interface die, and some or all of the dice may have interleaving conductive paths.

Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same

Methods of operating a memory device and memory devices are provided. For example, a method of operating a memory array is provided that includes a synchronous path and an asynchronous path. A Write-with-Autoprecharge signal is provided to the synchronous path, and various bank address signals are provided to the asynchronous path. In another embodiment, the initiation of the bank address signals may be provided asynchronously to the assertion of the Write-with-Autoprecharge signal.

Synchronous command-based write recovery time auto-precharge control

An off chip driver impedance adjustment circuit includes a storage circuit adapted to receive and store a drive strength adjustment word. A counter circuit is coupled to the storage circuit to receive the drive strength adjustment word and develops a drive strength count responsive to the drive strength adjustment word. A programmable fuse code to preset the counter. An output driver circuit is coupled to the counter circuit to receive the drive strength count and is adapted to receive a data signal. The output driver circuit develops an output signal on an output responsive to the data signal and adjusts a drive strength as a function of the drive strength count.

Method and circuit for off chip driver control, and memory device using same

A data sort device for converting parallel data to serial data is disclosed and provided. The data sort device may include a plurality of switches for receiving parallel data, each of which are controlled by a respective control signal and configured to alternatingly transmit data bits received via first and second input terminals.

Parallel-to-serial data sort device

A data strobe synchronization circuit includes first and second logic circuits receiving global data strobe pulses and respective enable signal. A control circuit initially applies an enable signal to the first logic circuit so that the first logic circuit generates a first data strobe pulse responsive to each global data strobe pulse. The control circuit receives a write control signal. When the write control signal becomes active, the control circuit terminates the enable signal applied to the first logic circuit and applies an enable signal to the second logic circuit. The second logic circuit then generates a second data strobe pulse responsive to the next global data strobe pulse. The first and second data strobe pulses are used to latch a data signal in respective flip-flops. The data strobe pulses may latch the data signal in pairs of flip-flops on the leading and trailing edges of the data strobe pulses.

Data strobe synchronization circuit and method for double data rate, multi-bit writes

A method and apparatus to convert parallel data to serial data is provided. More specifically, there is provided a parallel-to-serial converter comprising a data pipeline configured to receive parallel data, and binary sort logic comprising a plurality of switches arranged to receive the parallel data from the data pipeline, and configured to output the parallel data serially.

Method and apparatus for converting parallel data to serial data in high speed applications

An apparatus and method for selecting a storage location in a memory device including receiving at least one of a pre-decoded location address signal, a match signal, and a redundant location address enable signal, enabling one of a decoder and a redundant decoder in response to the match signal, wherein the decoder is operable to generate a location select signal for selecting a first location, the decoder being responsive to the pre-decoded location address signal, and wherein the redundant decoder is operable to generate a redundant location select signal for selecting a second location, the redundant decoder being responsive to the redundant location address enable signal, and terminating one of the generation of a location select signal and the generation of a redundant location select signal in response to a precharge signal.

Growing community of inventors

Boise, ID, United States of America

Christopher K Morzano