International Business Machines Corporation

Christopher John Majka

Matthew Francis Seward

How Tzu Lin

Richard Ronald Hall

Ronald Verne Smith

Benson Chan

John Henry Sherman

James E Frushour

John E Swenson

Earle W Gillis

Michael M Westgate

Norman Corey Seastrand

John C Clark, Jr

Michael L Mahar

An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.

Optical coupler replication arrangement and process

A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.

Method and apparatus to establish circuit layers interconnections

A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.

Multi-layered high density connections

An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

Solid conductive element insertion apparatus

A method and apparatus for locating a short between two nets in an electrical wire network of a microelectronic structure (e.g., chip, chip carrier, circuit card, etc.). A first net and a second net of the electrical wire are electrically shorted at an unknown point P on the first net. Points P and P on the first net such are selected such that P is located on a path between P and P along the first net. A constant current pulse source is electrically connected between P and P and is activated. Voltage drops V (from P to P ) and V (from P to a point P on the second net) are measured. A length L of the path from P to P is calculated as a function of V /V . Computer graphics may be used to graphically display the location of the short within the microelectronic structure.

Method and apparatus for determining the location of a short in an electrical wire network

A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned at an angle away from the probe base and is held in its angled position with respect to the probe base by a probe holder and a probe clamp. Upper and lower cantilever springs are positioned within a hollowed portion of the probe base, and provide a spring return of the probe when a push button is released from its depressed position. A spacer is provided between the upper and lower cantilever springs.

Probe for testing and repairing printed circuit features

An automated inspection system particularly adapted for detection and discrimination of surface irregularities of specularly reflecting and other materials, such as are employed in laminate chip carriers and printed circuit boards, includes an area scan image sensor allowing illumination sources to surround an area of a surface being inspected. The illumination source preferably provides either or both bright field and dark field illumination of the surface; developing generally complementary images of surface irregularities. A self-registering rules-driven process for developing inspection masks reduces alignment operations and improves performance. Image enhancement and morphological operations to detect surface irregularities are performed by digital signal processing, preferably using a dedicated vision processor. Masks screen potential defects to critical mounting and bonding surfaces accurately without requiring alignment of data or reference images to acquired images. Since potential defects are copied from acquired images and stored, verification of defects may be performed without further access to the inspected part and without removal of the part to another specialized apparatus, simplifying processing and increasing throughput and operator efficiency.

Automated inspection system for metallic surfaces

The accuracy of a capacitive testing procedure is improved by adjusting the ideal values against which comparisons are made during the testing process, for all of the circuit elements (e.g., pin connections) being tested, responsive to cumulative deviations of the measured values from their anticipated ideal values. This can be accomplished by initially comparing all of the capacitance measurements taken for a given printed circuit to their ideal values, and calculating a deviation for each of the comparisons made. Following the testing of an entire printed circuit, the resulting series of calculated deviations are tabulated and averaged, and the resulting average deviation is then added to or subtracted from the tabulated readings for each of the circuit elements before any true defects are identified for the printed circuit being tested. In this way, all of the parts being tested are brought to the same baseline, eliminating overall reference differences (i.e., between different panels).

Process and apparatus for the capacitive testing of printed circuits

A collision avoidance system for a two arm robot is direction sensitive. When the separation between the arms is sensed as equal to or smaller than a predetermined distance, the trailing arm is slowed to avoid a collision. The separation sensor generates a first 'slow' signal when the separation is a first predetermined distance, a second 'slow' signal when the separation is a second predetermined distance, smaller than the first, and a 'stop' signal when the separation is a third predetermined distance, smaller than the second. The polarity of the drive signals for the arms determine their direction, and polarity sensitive comparators determine the direction of each arm. When the first 'slow' signal is present and one arm is moving in the direction of the other arm, a speed reducing resistor is inserted in the circuit for the drive signal for the one arm to reduce its speed. When the second 'slow' signal is also present, a second speed reducing resistor is inserted in the drive signal circuit for the one arm, further reducing the velocity. A 'stop' signal causes a controller to stop both arms.

Growing community of inventors

Owego, NY, United States of America

Christopher John Majka