Amazon Technologies, Inc.

Qualcomm Incorporated

Christopher John Kraeutle

Bradley David Urban

Christopher Lorenzo Dunn

Aviv Shoval

Ryan Michael Fleming

Jason Conrad Chamberlain

Stephen Theodore Schooley

Hoang M Nguyen

Giancarlo Giustina

Evan Lawrence Coons

Marcus-Alan Gilbert

Kenneth James Albanowski

Mostafa Kashi

Kok Yen Cheng

Manuel Rosendo Arana Manzano

Bryan Dan Trinh

Robert Olson

James Nelson Aldrich

Alexander Hu

Eduardo Bezerra Valentin

Christopher Michael Buonomo

Nagesh Rao Janapala

David Joseph Derrick

Various examples are directed to providing thermal management to a computing device. The computing device may receive temperature state data describing a temperature state of the computing device. The temperature state may comprise a first temperature value at a first location at the computing device. The computing device may also receive use state data describing a first use state of the computing device. The first use state may comprise an initial operating condition of a first component of the computing device and an initial operating condition of a second component of the computing device. The computing device may determine that at least one temperature value at the computing device is out-of-range and select a second use state for the computing device. The second use state may comprise at least one of a new operating condition for the first component or a new operating condition of the second component.

System level thermal management

Content hub

An electronic device includes an elongated tubular housing. One or more electronic components are coupled to a chassis disposed in a cavity of the tubular housing. A pair of elongated channels are positioned on opposite sides of the chassis and between the chassis and a sidewall of the tubular housing. The channels are tapered or wedge-shaped along their lengths. During assembly, one of the channels may be slid longitudinally along the other, causing the channels to expand laterally, due to their wedge shape, to secure the chassis in the tubular housing. The chassis and the pair of channels provide a thermally conductive path to dissipate heat. During use, heat generated by the electronic components is transmitted radially outward from the electronic components, through the chassis and the pair of channels, and through the tubular housing to the exterior of the portable electronic device.

Electronic device with efficient thermal dissipation

Device display assemblies that include layered components provided with alignment features are disclosed. Protective sheets that are adhered to other layered components of a display assembly may be provided with alignment features that are utilized as part of an alignment process to accurately align the protective sheets with respect to the other layered components as well as to align the display assembly with respect to other device components such as a cover glass. Alignment features may also be provided in other layered components of a display assembly in addition to the protective sheets.

Alignment features for improved alignment of layered components of a device display

A mobile computing device is presented. The mobile computing device has two housing segments that each contains a set of electrical components. The housing segments are slideably coupled to each other to move between a first position and a second position. The mobile computing device also has a cable connector that connects the sets of electrical components together. The cable connector is configured to include three connector structures that are each configured to mate with a connector. A first connector structure is configured to mate with a first connector of the first housing segment in connecting to the first set of electrical components. Similarly, a second connector structure is configured to mate with a first connector of the second housing segment in connecting to a first portion of the second set of electrical components. The third connector structure is configured to mate with a second connector of the second housing segment in connecting to a second portion of the second set of electrical components.

Small form factor computing device with connector assembly to interconnect sliding housing segments

Growing community of inventors

Santa Clara, CA, United States of America

Christopher John Kraeutle