Plessey Overseas Limited

Christopher J Wort

Stuart Philip Speakman

David J Pedder

Kim L Pickering

Lynn Y Dorey

A dry solder reflow process, in which metal surface oxides are removed from the solder surface by abstraction of the oxygen from the metal oxide by atomic hydrogen, the atomic hydrogen being created within an intense microwave frequency plasma of a gas containing hydrogen.

Metal surface cleaning processes

A thin film deposition process comprises the steps of providing a first target area on a magnetron electrode, sputtering particles from said area so that they fall onto a heated substrate body for forming the required deposit, simultaneously operating a sputtering gun such that further particles are dislodged from a second target area and directed towards the substrate, the two resulting particle plasmas mixing at the substrate surface such that a deposit of a predetermined chemical composition is produced. This allows a multicomponent material such as a PLZT ceramic to be deposited without a change in composition due to different volatilities etc. of the components.

Thin film deposition process

A prior art method of depositing Germanium Carbide involves the use of glow discharge techniques which are problematic in that they require high substrate temperatures. Methods embodying the present invention comprise exposing a target of germanium to a plasma comprising an inert gas and a halocarbon gas. The plasma is maintained by means of a radio frequency magnetron electrode which is associated with the target. Atoms and ions of Germanium and Carbon are sputtered onto the substrate in order to deposit the Germanium Carbide.

Growing community of inventors

Northants, United Kingdom

Christopher J Wort