Agere Systems Inc.

Christopher J Wittensoldner

Ashley Rebelo

Gavin Appel

Lane Allen Smith

Donald Raymond Laturell

Ellis E Nease

Timothy W Fuehrer

A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.

Method and article of manufacture for wire bonding with staggered differential wire bond pairs

A system for improving the attenuation of an undesired signal found in a differential signal path through the use of inductive coupling. The system includes a primary inductor, a secondary inductor, and a filter. The primary inductor and the secondary inductor operably couple an input differential signal pair to an output differential signal pair, and the filter attenuates an undesired signal in the output differential signal pair.

Inductive coupling for communications equipment interface circuitry

An integrated circuit comprises an integrated circuit package and one or more circuit elements disposed within the integrated circuit package. The integrated circuit also comprises at least two differential wire bond pairs providing connections for at least one of the one or more circuit elements. Proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.

Integrated circuit with staggered differential wire bond pairs

An integrated circuit package having a multi-segment transmission line transformer for impedance matching a packaged integrated circuit, such as a driver or receiver, to a printed circuit board (PCB) transmission line to which the packaged chip is attached by, for example, solder balls. In one exemplary embodiment, a three-segment transmission line transformer provides improved broadband performance with the advantage of having a middle segment with a flexible length for easier routing. The length of each end segment of the three-segment transformer is adjusted to provide at least partial cancellation of reflections between the PCB and the transformer, and between the transformer and a circuit on the integrated circuit, respectively. Further, the inductive reactance of the solder balls and via wiring may be cancelled out by the transformed chip impedance to provide a non-inductive termination to the PCB transmission line at approximately one-half the highest data rate of the channel.

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Alburtis, PA, United States of America

Christopher J Wittensoldner