Rogers Corporation

World Properties, Inc.

Garlock Sealing Technologies, LLC

Christopher J Caisse

Allen F Horn, Iii

Patricia A LaFrance

Karl Edward Sprentall

Stefan Pitolaj

Dirk M Baars

Sankar Paul

Disclosed herein is a hexaferrite composite comprising polytetrafluoroethylene; and greater than or equal to 40 vol %, or 40 to 90 vol % a plurality of CoZ hexaferrite particles based on the total volume of the polytetrafluoroethylene and the plurality of CoZ hexaferrite particles on a void-free basis; wherein the hexaferrite composite has a porosity of greater than or equal to 10 vol % based on the total volume of the hexaferrite composite; wherein the hexaferrite composite has a permeability of greater than or equal to 2.5 and a ratio of the permeability to the permittivity of greater than or equal to 0.4, both determined at 500 MHz.

Polytetrafluoroethylene hexaferrite composites

In an embodiment, a dielectric substrate comprises an unsintered polytetrafluoroethylene; and a high dielectric constant filler, wherein the dielectric constant of the high dielectric constant filler is greater than or equal to 35; wherein the dielectric substrate has a specific gravity of greater than or equal to 90% of a calculated theoretical density of the dielectric substrate, wherein the theoretical specific gravity is calculated based on a measured specific gravity of the high dielectric constant filler, the specific gravity of the unsintered polytetrafluoroethylene, and the relative weight fractions of the unsintered polytetrafluoroethylene and the high dielectric constant filler; and wherein the dielectric substrate has a dielectric constant of greater than or equal to 11.5 as determined at a frequency of 10 GHz.

Dielectric substrate comprising unsintered polytetrafluoroethylene and methods of making the same

A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Circuit materials, circuits laminates, and method of manufacture thereof

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Danielson, CT, United States of America

Christopher J Caisse