Hewlett-packard Development Company, L.p.

Google Inc.

Hewlett-packard Company

X Development LLC

Hewlett Packard Enterprise Development LP

Exaflop LLC

Christopher Gregory Malone

Glenn Cochran Simon

Thane Michael Larson

Madhusudan K Iyengar

Ankit Somani

James Kennedy

Norman Paul Jouppi

Jyoti Sastry

Eduardo Lao

Varun Sakalkar

Stephan Karl Barsun

Jimmy Clidaras

Thomas R Kowalski

Cullen Edwin Bash

Chandrakant D Patel

Teckgyu Kang

Woon-Seong Kwon

Pascal C Kam

Jorge Padilla

Melanie Beauchemin

Yuan Hang Li

Ricardo Ernesto Espinoza-Ibarra

Gregory P Imwalle

Thomas J Augustin

Andrew B Carlson

Anand Ramesh

Harold Miyamura

Madhu Krishnan Iyengar

Christian Laszlo Belady

Abdlmonem H Beitelmal

Michael C Ryan

Wade David Vinson

Jacques L Gagne

Bryan David Bolich

Martin Goldstein

Thomas L Vaden

Emad Samadiani

Stephen Daniel Cromwell

Carey Huscroft

Robert J Nelson

Padam Jain

Connor Burgess

Bryan Christopher GilroySmith

Yingying Wang

Thom Augustin

Nicholas Stevens-Yu

Ratnesh Kumar Sharma

Eric C Peterson

Joseph R Allen

Ryan Charles Abbott

Amip J Shah

Taliver Heath

Luiz Andre Barroso

Michael Leslie Wortman

Martin O Nicholes

David M Paquin

Jeremy Ian Wilson

Stephen B Lyle

Jeffery Michael Giardina

Ken G Robertson

Nathaniel Edward Pettis

Yuan Li

Victoria Tsang Tam

Rich Bargerhuff

Dennis C Thompson

Stephanie Hua Taylor

Robert J Lankston, Ii

Teck-Gyu Kang

Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.

Integrated circuit with a ring-shaped hot spot area and multidirectional cooling

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material ('TIM') having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Methods and heat distribution devices for thermal management of chip assemblies

A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry electrical power from a power source through a human-occupiable workspace of a data center. The live conductor surface includes a rail configured to mount to a floor of the data center. The data power system further includes a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices and moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.

Powering electronic devices in a data center

Techniques for providing carbon dioxide include generating thermal energy, an exhaust fluid, and electrical power from a power plant; providing the exhaust fluid and the generated electrical power to an exhaust fluid scrubbing system to separate components of the exhaust fluid; capturing heat from a source of heat of an industrial process in a heating fluid; transferring the heat of the industrial process captured in the heating fluid to a carbon dioxide source material of a direct air capture (DAC) system; providing the generated electrical power from the power plant to the DAC system; providing the thermal energy from the power plant to the DAC system; and separating, with the transferred portion of the heat of the industrial process and the provided thermal energy, carbon dioxide from the carbon dioxide source material of the DAC system.

Producing carbon dioxide with waste heat

A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material ('PCM') attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.

Thermal management of battery units on data center racks

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

Cooling electronic devices in a data center

A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.

While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages

This specification describes a power distribution system comprising a first section that receives power from a first source. The power at the first section is adjusted by a rectifier coupled to a power bus of the first section. The system includes a second section that is separate from the first section and that receives power from a second source. The power at the second section is adjusted by a rectifier coupled to a power bus of the second distribution section. The system includes a swing rectifier connected to each of the first and second sections. The swing rectifier is configured to provide power to the first power bus and to the second power bus and to dynamically adjust the power capacity of the first section that is available to computing loads, and to dynamically adjust the power capacity of the second section that is available to computing loads.

Modular direct current (DC) architectures

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for reducing variations in power consumption. In one aspect, a system includes a power controller communicatively coupled to a power source and a plurality of computing devices of an Information Technology (IT) stack electrically coupled to the power source. The controller configured to perform operations including monitoring variations in power consumption of the plurality of computing devices, determining, for the plurality of computing devices and based on the monitored power consumption, a power consumption profile for the plurality of computing devices that describes historical statistics of the power consumption, reducing variations in power consumed by the IT stack by adjusting performance of devices consuming power from the power source or adjusting which devices in the IT stack are consuming power from the power source based on a change in the power consumption and the power consumption profile.

Fuel cell power management

A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.

Evaporative induction cooling system for a data center

Growing community of inventors

Loomis, CA, United States of America

Christopher Gregory Malone