Novellus Systems Incorporated

Christopher Gage

David Cohen

Nagarajan Kalyanasundaram

Charles E Pomeroy

Jon Henri

Lee Peng Chua

Henner Meinhold

Dan M Doble

Apparatuses and methods for cooling and transferring wafers from low pressure environment to high pressure environment are provided. An apparatus may include a cooling pedestal and a set of supports for holding the wafer above the cooling pedestal. The average gap between the wafer and the cooling pedestal may be no greater than about 0.010 inches. Venting gases may be used to increase the pressure inside the apparatus during the transfer. In certain embodiment, venting gases comprise nitrogen.

Minimum contact area wafer clamping with gas flow for rapid wafer cooling

Methods that increase the overall rate of heat transfer between a substrate and a heat sink or source, e.g., in a loadlock are provided. According to various embodiments, the methods involve varying the heat transfer coefficient of a heat transfer gas in the loadlock or other chamber. The heat transfer coefficient is varied to reduce the time-dependent variation of the rate of heat transfer. As a result, the overall rate of heat transfer is improved. In certain embodiments, the methods involve varying the gas pressure of a chamber in order to affect the rate of heat transfer to a wafer within a system. By manipulating the gas pressure accordingly, the rate of heat transfer is controlled throughout the heating or cooling cycle.

Transferring heat in loadlocks

The present invention provides methods and apparatuses for removing unwanted film from the edge area of substrate using remotely-generated plasmas. Activated plasma species are directed to the edge of the substrate to contact and remove the unwanted film, while intrusion of the activated species to areas above the active circuit region (where the film is desired) is suppressed. In certain embodiments, intrusion of the activated species is suppressed by the use of a purge gas and/or the use of materials that promote recombination of plasma species. In particular embodiments, atomic oxygen is used to remove ashable films from the edge of semiconductor wafers.

Edge removal of films using externally generated plasma species

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Campbell, CA, United States of America

Christopher Gage