Aptiv Technologies Limited

Aptiv Technologies Ag

Christopher G Reider

David R Peterson

Jared Bilas

George Albert Drew

Kurt Paul Seifert

Gerald A Rhinehart, Jr

John Thomas Kightlinger

Kurt P Seifert

Therese G Stevens

Doyeon Y Sohn

Gerald A Rhinehart Jr

A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.

Wiring harness assembly having multiple separated conductors embedded within a substrate

A wiring harness assembly includes a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, a location feature integrally formed with the substrate, and an opening defined in the substrate located within a predetermined tolerance relative to the location feature. A section of the plurality of electrically conductive wires is exposed within the opening.

A wiring harness assembly includes a plurality of separated conductors formed of an electrically conductive material, a substrate formed of a dielectric material encasing the plurality of separated conductors, a location feature integrally formed with the substrate and an opening defined in the substrate having a predetermined size and shape. A section of the plurality of separated conductors is exposed within the opening. The opening is precisely located relative to the location feature.

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Canfield, OH, United States of America

Christopher G Reider