Rockwell Collins, Inc.

Christopher G Olson

Matilda Gabriela Livadaru

James B West

Jeremiah Damien Wolf

Lee M Paulsen

Jiwon L Moran

Michael J Buckley

James L Bartlett

James R Wooldridge

The system can include and the method can provide a first printed circuit board antenna tile. The first printed circuit board antenna tile comprises a repeating pattern of antenna element units. The antenna can also include and the method can also provide a second first printed circuit board antenna tile comprising the repeating pattern. The first printed circuit board antenna tile and the second first printed circuit board antenna tile can be attached such that the antenna elements maintain the same spacing in an X-Y plane associated with the repeating pattern across a boundary the first printed circuit board antenna tile and the second first printed circuit board antenna tile.

Tiling system and method for an array antenna

An antenna and manufacturing process for antennas produce radiating elements of desired size for certain frequency bands by bump mounting radiating elements to the printed circuit board substrate. Driving circuitry is stacked to save space. Also, the radiating elements are made using a different dielectric constant material as compared to the substrate. Tiling radiating elements or sub-arrays or radiating elements with bump mounting allows for spatial separation that eliminates surface waves. Bump mounted radiating elements also allow for multiple sizes of radiating elements in which smaller size provides lower directivity to cover broader beam scan performance.

Bump mounted radiating element architecture

An electronically scanned array (ESA) is configured for a high-degree of isolation between adjacent radiating elements and between co-located ports. Radiating elements of the ESA include a centrally located slot-aperture configured as a radiating source, and multiple via-apertures positioned around and between each port of the co-located ports. An amount of metamaterial structures found in a unit cell of an antenna layer ascendingly increases from a bottom antenna layer to a top antenna layer, with groups of metamaterial structures differing in orientation with respect to unit cells of two or more antenna layers and with respect to two groups found within a unit cell of the top antenna layer.

Dual-polarized, planar slot-aperture antenna element

An electronically scanned array radiating element includes a ground plane layer having a pair of conductive probes. A metallization layer is coupled with the ground plane layer and includes a first asymmetric cluster including HOF scattering members and impedance-matching dipoles. A first electrically-large impedance-matching dipole is coupled with one of the conductive probes and is associated with the first asymmetric cluster. The first electrically-large impedance-matching dipole and the first asymmetric cluster may cooperate with one another to produce a signal. A second asymmetric cluster includes HOF scattering members and impedance-matching dipoles. A second electrically-large impedance-matching dipole is coupled with the other conductive probe and is associated with the second asymmetric cluster. The electrically-large impedance-matching dipole and the asymmetric cluster may cooperate with one another to produce a second signal having a polarization orthogonal to the polarization of the first signal.

Dual polarized probe coupled radiating element

An integrated circuit chip and method of manufacturing the same which includes the use of a wafer cap having depressions therein for aligning with micro-electro-mechanical systems included in said integrated circuit when said cap is placed over a wafer containing numerous integrated circuits, the wafer is then cut, after the wafer cap is bound to the wafer. The wafer cap may also include a piezo-resistive element thereon for measuring pressure around the hermetically sealed MEMS.

Growing community of inventors

Robins, IA, United States of America

Christopher G Olson