Wakefield Engineering, Inc.

Other

Christopher G Morosas

A heating system for a building that includes a furnace having a water jacket surrounding a burner unit. Heated water is circulated from the water jacket to a heat exchange system in the building such as radiators and the water is returned to the water jacket through a return conduit to be reheated. Water from the jacket is also circulated through supplemental conduit through a gas tube water heat exchange apparatus located at the exhaust flue from the furnace for recovering heat from the exhaust gases. Water heated from the exhaust gases returns to the primary circulation system. More specifically, water flows from the cooler portions of the water jacket and/or the return conduit of the main circulation system to the gas-to-water heat exchange unit. Water flows from the gas-to-water heat exchange unit to the relatively warmer portions of the jacket and/or to the primary conduit that delivers water from the jacket to the heat exchange system of the building.

Heat recovery system

A spring clip for clamping a heat sink module to an electronic module which has a pair of opposite side edge surfaces and a pair of spaced projections which extend from each side edge surface. The spring clip includes an elongated generally horizontal middle segment, a pair of end segments at opposite ends of the middle segment which extend in a first direction at an upward angle and a finger tab segment which is connected to the middle segment and which extends at an upward angle in a second direction which is opposite the first direction. A spring clip and heat sink assembly is formed by attaching a pair of spring clips to opposite ends of the heat sink for application to an electronic module. A heat dissipating assembly is formed by applying the spring clip and heat sink assembly to an electronic module which has a pair of projections extending from opposite edge surfaces of the electronic module. The horizontal middle segment of the spring clip can be moved from an inactive state above a respected pair of projections to an active state beneath the projections so that the middle segment is biased upwardly against the projections for clamping the heat sink to the electronic component.

Spring clip for clamping a heat sink module to an electronic module

A fan driven heat sink assembly which includes a fan assembly mounted on a heat sink for mounting on a microprocessor unit. The heat sink has a solid flat base, a plurality of spaced cooling fins and a housing which is fixed to the base. The cooling fins are fixed to the base and extend from one flat surface of the base to a top wall of the housing. The top wall of the housing has an aperture which is aligned with an outlet opening of the fan assembly. The fins extend from a first end opening at one end of the housing to a second end opening at the opposite end of the housing. Airflow from the fan assembly extends from the opening in the top wall of the housing along the spaces between the fins and out through both end openings of the housing.

Growing community of inventors

Sutton, MA, United States of America

Christopher G Morosas