General Electric Company

Menlo Microsystems, Inc.

Princeton University

Ge Aviation Systems Limited

Ge Homeland Protection, Inc.

Christopher Fred Keimel

Marco Francesco Aimi

Kanakasabapathi Subramanian

Glenn Scott Claydon

William James Premerlani

Christopher James Kapusta

Joseph Alfred Iannotti

Xuefeng Wang

Kuna Venkat Satya Rama Kishore

Christopher Michael Puleo

John Norton Park

Yongjae Lee

Craig Patrick Galligan

David Cecil Hays

Parag Thakre

Andrew Minnick

Yizhen Lin

Reed Roeder Corderman

Kaustubh Ravindra Nagarkar

Todd Frederick Miller

Long Que

Yanfei Liu

Oliver Charles Boomhower

Xu Zhu

Christian Michael Giovanniello, Jr

Shubhra Bansal

Arun Virupaksha Gowda

Jeffrey Michael Ashe

Joshua Isaac Wright

Sergey Alexandrovich Zotov

Stephen Y Chou

Edward K Howell

Om Prakash

Robert C Davis

Juan J Becerra

Jason Harris Karp

Anis Zribi

Atanu Saha

Alex David Corwin

Sandip Maity

Kathleen Ann O'Brien

Robert Joseph Caggiano

Ralf Lenigk

Richard Vanfleet

Steven Y Go

James Enrico Sabatini

John Oliver Collins

Jeffrey Bernard Fortin

Stacey Joy Kennerly

Avinash Srikrishnan Kashyap

Brent Charles Kumfer

Andrew Joseph Detor

David J Lesslie

Todd Ryan Tolliver

Nancy Cecelia Stoffel

Shivappa Ningappa Goravar

Ayan Banerjee

Russell Mark Compton

Sairam Sundaram

Liming Yu

Bo Li

Xiaohui Chen

Julian Peter Mayes

Charles Stephan Pitzen

Joleyn Eileen Brewer

Christian M Giovanniello

Paul Jeffrey Gillespie

Sudhakar Reddy

Ajit Achuthan

Somashekhar Basavaraj

Sheila Tandon

Wensen Wang

Zhiyong Wang

Chris Nassar

John Brian Hewgley

Duraiswamy Srinivasan

Guohai Chen

Bo Cui

Somasundaram Gunasekaran

Kristina Margaret Korosi

Abhijeet Dinkar Sathe

Shankar (nmn) Chandrasekaran

Darryl R Evans

Renner Stephen Ruffalo

Jaeseok Jeon

Eddula Sudhakar Reddy

Andrew James Minnick

Christian Michael Giovanniello

Oliver Charles Boomhoower

Edward Keith Howell

David James Lesslie

Wang Wensen

A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

MEMS device built on substrate with ruthenium based contact surface material

A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.

Materials and methods for passivation of metal-plated through glass vias

A gyroscope includes at least one anchor and a plurality of gyroscope spring elements coupled to the at least one anchor. The gyroscope also includes a plurality of concentric rings coupled to the plurality of gyroscope spring elements and configured to encircle the plurality of gyroscope spring elements. The gyroscope further includes an excitation/detection/tuning unit electrostatically coupled to the plurality of concentric rings.

Inertial sensing systems and methods of manufacturing the same

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

Full symmetric multi-throw switch using conformal pinched through via

A power distribution switch including a micro electro mechanical system (MEMS) relay switch matrix disposed between a power source and an electrical load, and a controller module configured to operate the MEMS relay switch between a conducting and a non-conducting state, wherein the conducting state conducts power from the power source to the electrical load and the non-conducting state prevents power conduction from the power sources to the electrical load.

Power distribution switch for a power distribution system

The present approach relates to the fabrication and use of a probe array having multiple individual probes. In one embodiment, the probes of the probe array may be functionalized such that certain of the probes are suitable for electrical sensing (e.g., recording) or stimulation, non-electrical sensing or stimulation (e.g., chemical sensing and/or release of biomolecules when activated), or a combination of electrical and non-electrical sensing or stimulation.

Multimodal probe array

A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.

Low capacitance surge suppression device

A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit. An auxiliary circuit is coupled in parallel with the MEMS switching circuit, the auxiliary circuit comprising first and second connections that connect the auxiliary circuit to the MEMS switching circuit on opposing sides of the MEMS switch, first and second solid state switches connected in parallel, and a resonant circuit connected between the first and second solid state switches. A control circuit controls selective switching of a load current towards the MEMS switching circuit and the auxiliary circuit by selectively activating the first and second solid state switches and the resonant circuit so as to limit a voltage across the MEMS switch by diverting at least a portion of the load current away from the MEMS switch to flow to the auxiliary circuit prior to the MEMS switch changing state.

Auxiliary circuit for micro-electromechanical system relay circuit

A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit, and an auxiliary circuit coupled in parallel with the MEMS switching circuit that comprises solid state switching circuitry. A control circuit in communication with the MEMS switching circuit and the auxiliary circuit performs selective switching of a load current towards the MEMS switching circuitry and the auxiliary circuit, with the control circuit programmed to transmit a control signal to the driver circuit to cause the MEMS switch to actuate to an open or closed position across a switching interval, activate the auxiliary circuit during the switching interval when the MEMS switch is switching between the open and closed positions, and deactivate the auxiliary circuit upon reaching the open or closed position after completion of the switching interval, such that the load current selectively flows through the MEMS switch and the solid state switching circuitry.

Micro-electromechanical system relay circuit

A switching system includes a control circuit that receives On-Off signals indicative of a desired operating state of a switch. The control circuit includes an oscillator that generates a first electrical pulse responsive having a first signal characteristic or a second signal characteristic that is determined by the received On-Off signal, which may be related to a frequency or duty cycle of the pulse. A pulse transformer connected to the oscillator receives the first electrical pulse and outputs a second electrical pulse having the same one of the first signal characteristic and the second signal characteristic as the first electrical pulse. A pulse detection circuit in the control circuit receives the second electrical pulse, determines whether the second electrical pulse has the first signal characteristic or the second signal characteristic, and controls transmission of power and control signals to the switch based on this determination.

Isolated control circuit and driver for micro-electromechanical system switch

A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.

Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same

A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.

Refractory seed metal for electroplated MEMS structures

An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Pulse oximetry devices and systems and methods of making the same

Growing community of inventors

Schenectady, NY, United States of America

Christopher Fred Keimel