E.i. Dupont De Nemours and Company

Other

Dupont Electronics, Inc.

University of Connecticut

Rohm & Haas Electronic Materials LLC

Christopher Dennis Simone

Brian C Auman

Christian Peter Lenges

Thomas Edward Carney

Joseph Casey Johnson

Jiang Ding

Carl Robert Haeger

Richard A Wessel

Peter Francis Carcia

Daniel A Scola

Jaclyn Murphy

G Sidney Cox

Catherine Mulzer

Husnu Alp Alidedeoglu

Peggy Scott

Grzegorz Slawinski

Sidney G Cox

Patricia Gumbley

Cecilia Hall

Benjamin Naab

Delanie J Losey

In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (S) of the interface between the polymer film and the first metal layer is less than 1 μm. The peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 μm or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.

Metal-clad polymer films and electronic devices

In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Dof 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g&#xd7;mil)/(m&#xd7;day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

Polymer films and electronic devices

A display clip for supporting an object for display. The display clip includes two bilateral stops terminating in opposing projections wherein the stops are spaced a distance apart, and the opposing projections point substantially in opposite directions. The opposing projections fit removably into channel(s) on a display stand or other support structure, holding the display clip in place. The display clip also comprises one or more catches located at the front of the display clip capable of retaining the object, a plurality of side support members connecting a given stop with a given catch, and one or more crossbars connecting two or more side support members.

Display clip

A reversible display device including a base-shelf having a planar surface, a back panel attached to the base-shelf, and at least one clip having an upward extending stop. The display device has a first orientation such that the planar surface is a base for the display device and a second orientation such that the planar surface is a top shelf for the display device. The clip is removably attached to the back panel such that the upward extending stop is oriented upward in either the first or the second orientation.

Reversible and adjustable display device

The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3',4,4&#x2032;-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2&#x2032;-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4&#x2032;-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.

Circuit board

The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3',4,4&#x2032;-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2&#x2032;-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4&#x2032;-oxydianiline.

The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.

Light emitting diode assembly and thermal control blanket and methods relating thereto

Display stand

The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Polycyclic polyimides and compositions and methods relating thereto

Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3',4,4&#x2032;-biphenyltetracarboxylic dianhydride (BDPA) and 2,2&#x2032;-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between &#x2212;5 and +20 ppm/&#xb0; C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g., cellular phones, personal digital assistants, portable video games, laptops, and the like).

Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto

A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenylethynyl end-capped bismides blended with PETIs are disclosed. Processes for their production including: 1) modification of PETI-5 oligomer by molecular weight adjustments by blending with reactive low melting phenylethynyl end-capped imide monomers, 2) modification of the PETI-5 backbone structure with other diamine components, and 3) modification of the PETI-5 backbone with bulky fluorinated groups are also disclosed.

Growing community of inventors

Pickerington, OH, United States of America

Christopher Dennis Simone