Kateeva, Inc.

Applied Materials, Inc.

Christopher Cocca

Stan D Tsai

Shou-Sung Chang

Charles C Garretson

Jason Garcheung Fung

Sivakumar Dhandapani

Gregory E Menk

Hung Chih Chen

Jun Qian

Daxin Mao

Sameer Deshpande

This disclosure provides techniques for assessing quality of a deposited film layer of an organic light emitting diode ('OLED') device. An image is captured and filtered to identify a deposited layer that is to be analyzed. Image data representing this layer can be optionally converted to brightness (grayscale) data. A gradient function is then applied to emphasize discontinuities in the deposited layer. Discontinuities are then compared to one or more thresholds and used to ascertain quality of the deposited layer, with optional remedial measures then being applied. The disclosed techniques can be applied in situ, to quickly identify potential defects such as delamination before ensuing manufacturing steps are applied. In optional embodiments, remedial measures can be taken dependent on whether defects are determined to exist.

Systems, devices and methods for the quality assessment of OLED stack films

Systems, devices and methods for quality monitoring of deposited films in the formation of light emitting devices

Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Closed-loop control for improved polishing pad profiles

A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Closed-loop control for effective pad conditioning

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Fremont, CA, United States of America

Christopher Cocca