Rogers Corporation

Christopher Brown

Kristi Dhimiter Pance

Karl Edward Sprentall

Gianni Taraschi

Roshin Rose George

Dirk M Baars

Stephen O'Connor

Bruce B Fitts

William Blasius

Murali Sethumadhavan

Shawn P Williams

Michael S White

Michael Lunt

Sam Henson

John Dobrick

Allen F Horn, Iii

Trevor Polidore

Shailesh Pandey

Sara G Canzano

Jared DuPerre

Eui Kyoon Kim

In an embodiment, a printed circuit board substrate () comprises a polymer matrix; a reinforcing layer (); and a plurality of coated boron nitride particles (); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.

Printed circuit board substrate comprising a coated boron nitride

A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.

Dielectric electromagnetic structure and method of making the same

An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Electromagnetic dielectric structure adhered to a substrate and methods of making the same

In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.

A wearable electromagnetic, EM, apparatus includes: at least one antenna operable in a millimeter-wave-radar-based, MWRB, application; at least one computer processor disposed in signal communication with the at least one antenna; an attachment system configured and adapted to attach to an actor; the at least one antenna and the at least one computer processor disposed in a supported relationship with the attachment system, such that the attachment system with the supported at least one antenna and the at least one computer processor at least partially forms a wearable apparatus that is wearable by the actor.

Millimeter-wave-radar-based electromagnetic apparatus

Growing community of inventors

Natick, MA, United States of America

Christopher Brown