Adeia Semiconductor Bonding Technologies Inc.

Christopher Aubuchon

Belgacem Haba

Gal Shabtay

Rajesh Katkar

Laura Wills Mirkarimi

David Mendlovic

Kai Engelhardt

A bonded structure with protective semiconductor elements including a semiconductor element with active circuitry and a protective element including an obstructive layer and/or a protective circuitry layer. The obstructive layer is configured to inhibit external access to at least a portion of the active circuitry. The protective circuitry layer is configured to detect or disrupt external access to the protective element and/or the active circuitry of the semiconductor element. The semiconductor element and the protective element are directly bonded without an adhesive along a bonding interface.

Protective semiconductor elements for bonded structures

An image capturing device may include a detector including a plurality of sensing pixels, and an optical system adapted to project a distorted image of an object within a field of view onto the sensing pixels, wherein the optical system expands the image in a center of the field of view and compresses the image in a periphery of the field of view, wherein a first number of sensing pixels required to realize a maximal zoom magnification {circumflex over (Z)} at a minimum resolution of the image capturing device is less than a square of the maximal zoom magnification times a second number of sensing pixels required for the minimum resolution.

Imaging system with multi-state zoom and associated methods

Growing community of inventors

San Jose, CA, United States of America

Christopher Aubuchon