Wells-cti, Inc.

Sensata Technologies, Inc.

Christopher A Lopez

Brian J Denheyer

Gordon B Kuenster

Thomas F Lemczyk

Rick A Davis

Richard A Davis

David L Weston

A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.

Free piston stirling cooler temperature control system for semiconductor test

Featured are devices, systems and methods for testing an electronic device, such as an integrated chip. Such a testing method includes disposing a thermal clutch between a variable heat sink that absorbs heat energy and a heat source member that selectively delivers heat energy. When the thermal clutch is operated in a first manner the thermal clutch thermally couples the variable heat sink to the electronic device under test (DUT) and when operated in the second manner, the thermal clutch thermally de-couples the variable heat sink from the DUT. Also, when the thermal clutch is operated in the second manner, the heat source member is thermally coupled to the DUT and is operated so as to produce heat energy which is thus provided to the thermally coupled DUT.

Thermal clutch for thermal control unit and methods related thereto

A thermal control unit (TCU) for controlling temperature of a device under test (DUT) includes a sealed evaporation chamber disposed therein, the evaporation chamber configured with a refrigerant inlet and a refrigerant outlet; and at least one surface for thermal engagement of the device under test and configured to conduct heat to the evaporation chamber. A test system and a computer program product are disclosed.

Direct injection phase change temperature control system

Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).

Package on package thermal forcing device

An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

Burn-in testing apparatus and method

An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.

Temperature sensing and prediction in IC sockets

An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC. The method of sensing the temperature of an IC includes actively changing the temperature of an IC with a heater or cooler, sensing the temperature of the IC with a temperature sensor positioned within a conductive sensor housing in thermal contact with the IC and thermally insulating the sensor housing and temperature sensor from the heater or cooler.

Growing community of inventors

Phoenix, AZ, United States of America

Christopher A Lopez