Kla Corporation

Kla Tencor Corporation

Christophe Wouters

Carl Truyens

Tom Marivoet

Benoit Maison

Johan De Greeve

Karel Van Gils

Andy Hill

Carl Smets

Frans Nijs

Steven Boeykens

Kristiaan Van Rossen

Laurent Hermans

Kristof Joris

An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

Apparatus, method and computer program product for defect detection in work pieces

A first light source is directed at an outer surface of a workpiece in an inspection module. The light from the first light source that is reflected from the outer surface of the workpiece is directed to the camera via a first pathway. The light from the first light source transmitted through the workpiece is directed to the camera via a second pathway. A second light source is directed at the outer surface of the workpiece 180&#xb0; from that of the first light source. The light from the second light source that is reflected from the outer surface of the workpiece is directed to the camera via the second pathway. The light from the second light source transmitted through the workpiece is directed to the camera via the first pathway.

Combined transmitted and reflected light imaging of internal cracks in semiconductor devices

3D measurements of features on a workpiece, such as ball height, co-planarity, component thickness, or warpage, are determined. The system includes a broadband light source, a microlens array, a tunable color filter, a lens system, and a detector. The microlens array can focus a light beam to points in a focal plane of the microlens array. The tunable color filter can narrow the light beam to a band at a central wavelength. The lens system can provide longitudinal chromatic aberration whereby different wavelengths are imaged at different distances from the lens system.

Chromatic confocal area sensor

An object carrier, a system and a method is disclosed for the back light inspection of transparent or semitransparent objects. The carrier has a carrier base layer with photo luminescent properties which carries the transparent or semitransparent object on top of the layer. The transparent or semitransparent object could be a wafer and the object carrier could be a wafer chuck. At least one light source being arranged above the object carrier such that excitation light emitted from the at least one light source is directed through the transparent or semitransparent object to the layer with photo luminescent properties. The light returned from the layer with photo luminescent properties is collected by an objective and registered by a sensor.

Object carrier, system and method for back light inspection

An apparatus () and a method for the three dimensional inspection of saw marks () on at least one surface () of a wafer () are disclosed. At least one camera () is required to capture an image of the entire surface () of the wafer (). At least one line projector () provides a light bundle (), centered about a central beam axis (). The line projector () is arranged such that the central beam axis () is at an acute angle (&#x3b1;) with regard to the plane (P) of the wafer (). A line shifter () is positioned in the light bundle () between each line projector () and the surface () of the wafer (). A frame grabber () and an image processor () are used to synchronize and coordinate the image capture and the position of the pattern () of lines () on the front side (F) and/or the back side (B) of the wafer ().

Apparatus and method for three dimensional inspection of wafer saw marks

Growing community of inventors

Balen, Belgium

Christophe Wouters