Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Institut National Des Sciences Appliquees De Lyon

Photonera France

Intexys

Commissariat a L'energie Atomique Et Aux Energies Alternatives Batiment Le Ponant D

Institut National Des Sciences Appliquees

Christophe Kopp

Salim Boutami

Karim Hassan

Stéphane Bernabe

Jean-Marc Fedeli

Christophe Martinez

Badhise Ben Bakir

Philippe Grosse

Daivid Fowler

Regis Orobtchouk

Sylvie Menezo

Xavier Hugon

Tony Maindron

Bruno Mourey

Alexei Tchelnokov

Bertrand Szelag

Denis Pelenc

Francois Baleras

Jacques Raby

Jacqueline Bablet

Marco Casale

Vincent Liot

Cyrille Rossat

Stephane Bernabe

Simon Plantier

Régis Orobtchouk

The invention provides an optical particle sensor () comprising:

Optical particle sensor

A photodiode which includes a core of a first waveguide that terminates in a tapered termination that extends above a core, made of germanium or of SiGe, of a second waveguide, a matching strip that extends opposite the tapered termination on one side and opposite the core of the second waveguide on the opposite side, this matching strip being coupled optically to the core of the second waveguide by an evanescent coupling and including a first zone inside which its effective propagation index is equal to the effective propagation index of a second zone of the tapered termination, these first and second zones optically coupling the tapered termination to the matching strip through a modal coupling, and a low-index layer that extends between the matching strip and the tapered termination.

Photodiode with improved power absorption

An optical coupling device for producing an optical coupling between an optical fiber and photonic circuits. The device includes a substrate and at least two coupling stages integrated on the substrate, and: each coupling stage includes a grating coupler configured to implement an optical coupling centered on a respective central wavelength; the multiple grating couplers are superimposed on top of each other, along an axis orthogonal to the substrate plane; at least one of the grating couplers is insensitive to polarization. The device can form, for example, a wide band coupler, wherein each portion of the spectrum is coupled by a coupling stage. As an alternative, such a device can form an emitting and receiving coupler, where emission and reception spectra are each coupled by a respective coupling stage.

Multi-spectral optical coupler with low receive losses

A device for emission of an electromagnetic wave front designed to be connected in use to a light source emitting a light beam, and including at least three emission waveguides, each including a straight segment that receives one or several optical power extraction elements; and on the input side of each of the straight segments, a phase shift element and an optical coupler with an adjustable coupling ratio. At least two straight segments extend along straight lines that are not parallel to each other. An orientation of a principal emission beam is selected, defined in far field, by adjusting the coupling ratio of each of the optical couplers and the phase shift introduced by phase shift elements receiving the optical power. The invention is particularly advantageous in the context of remote detection.

Optical phased array with simplified addressing

This method for manufacturing a germanium slow light waveguide includes:

Method for manufacturing a germanium slow light waveguide and photodiode incorporating this slow light waveguide

A PIN structure semiconductor optical receiver includes first and second electrical contact layers and an intrinsic layer disposed between them. The intrinsic layer includes a stud having a stud axis and a stud cross-section. The first and second contact layers have dimensions in a plane perpendicular to the stud axis that are greater than the stud's cross-section. These layers are also elongated and have longitudinal axes offset angularly relative to each other to minimize facing areas of said electrical contact layers.

PIN structure semiconductor optical receiver

An optical duplexer intended to receive light at a first optical wavelength and to transmit back light at a second optical wavelength, including, on a substrate, successive layers forming a photoreceptor of the first optical wavelength, a selective filter letting through the first optical wavelength, and a waveguide having a surface including a grating which is transparent for the first optical wavelength and diffracting for the second optical wavelength.

Nanophotonic optical duplexer

An optical device including at least one first optical waveguide coupled to a second optical waveguide of smaller cross-section which penetrates into it on the side of a first end. The first optical waveguide is capable of being coupled with an optical fiber on the side of a second end. A surface of the first optical waveguide includes a diffraction grating capable of introducing-extracting-sending back light into and from the first optical waveguide.

Structure and method for aligning an optical fiber on an optical waveguide

The invention relates to a device for coupling an optical fiber and a nanophotonic component formed on a first substrate, wherein the device comprises: an intermediate component formed on a second substrate including a first wave guide adapted for receiving light from the optical fiber and for transmitting the same to a first diffraction grating independently from the polarization of the incident light; second and third diffraction gratings formed on the first substrate and coupled to the nanophotonic component, the first diffraction grating being adapted to provide the first and second light beams respectively towards the second diffraction grating and the third diffraction grating, the first and second beams having perpendicular polarizations.

Device for coupling an optical fiber and a nanophotonic component

Optical device with superimposed photonic circuits, for coupling to an optical waveguide. Said device comprises a substrate () and, on said substrate, an integrated photonic circuit () adapted to be coupled to at least one optical waveguide () which transmits a light signal () and for processing said signal. According to the invention, the circuit comprises two superimposed elementary integrated photonic circuits (), each of which is adapted to be coupled to a given polarization state of the signal and to process this state. The invention applies particularly to optical telecommunications.

Optical device with superimposed photonic circuits for coupling to one or more optical waveguides

An integrated optical circuit including an operational submicronic waveguide associated with an operational grating intended for the coupling with an optical fiber, further including an alignment grating, identical to the operational grating, associated with a blind waveguide and arranged at a known distance from the operational grating.

Structure and method for aligning an optical fiber and a submicronic waveguide

A non-destructive method for characterizing a surface-illuminated integrated optical coupler associated with an optical waveguide, comprising the steps of measuring the reflection coefficient on a first region of the coupler at a distance from the optical waveguide and constructing a first curve, determining a first model of the reflection coefficient on the first region, performing a first parameter fitting between the first curve and the first model to determine first parameters, measuring the reflection coefficient on a second region of the coupler close to the guide, and constructing a second curve, determining a second model of the reflection coefficient on the second region, performing a second parameter fitting between the second curve and the second model to determine second parameters, and constructing the characteristic of the coupling efficiency of the coupler using the first and second parameters.

Non-destructive testing of an integrated optical coupler in an integrated optical circuit

The method of coating the area of hybridization of a component that is constituted by two elements bonded to one another by means of a soldering material, including depositing proximate to the component a coating substance capable of filling by capillarity action the volume defined between the hybridized elements of the component. Further, along the periphery of the hybridization area on the lower element of the component is an area of non-wettability in regards to the coating substance, that is defined by depositing an anti-wetting covering of PECVD in regards to the coating substance, whereby the anti-wetting covering on the first element encompasses the hybridization area and surrounds a wetting surface for the coating substance.

Method for coating two elements hybridized by means of a soldering material

The light-emitting device includes a base substrate and preferably three light-emitting diodes respectively associated with three primary colors and emitting a part of their signal in the direction of the base substrate. The device includes three chromatic photodetectors formed in the base substrate constituting a semiconducting substrate, and each arranged under an associated light-emitting diode. Each chromatic photodetector includes superposed first, second and third layers. The first layer and third layer have a first type of conductivity and the second layer has a second type of conductivity. The device includes a control component connected to the chromatic photodetectors and to the light-emitting diodes to control the global color of the light emitted by the device.

Light-emitting device with chromatic control

This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on an object and on a support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of the object forms an angle of 70&#xb0; to 110&#xb0; with respect to each wettability area of the support and the object and the support are mutually distant from one another.

Growing community of inventors

Fontanil-Cornillon, France

Christophe Kopp