Analog Devices,inc.

Analog Devices International Unlimited Company

Christophe Antoine

David Frank Bolognia

John R Martin

Scott Robert Davis

Andrew William Sparks

Brian W Hall

Donal McAuliffe

Roman Trogan

Weidong Wang

Shane Geary

Xu Tang

Krishnan Ramaswamy Parameswaran

Ying-Ju Wang

Christina Mcloughlin

An optical illuminator assembly such as an integrated module can provide an illumination source for use in applications such as optical detection. A peak output power of the module can be enhanced as compared to other approaches, such as by one or more of controlling parasitic effects along an electrical pathway used to drive an optical emitter circuit included as a portion of the module, or by providing thermal management including establishing thermal conduction pathways through opposite surfaces of an optical emitter circuit such as an integrated circuit die comprising a solid-state optical emitter. Control schemes can be used that power various cells or functional blocks of the optical emitter independently. Thermal regulation can be provided by an active heat transfer element such as a thermoelectric cooler (TEC). An optical illuminator assembly can be optically coupled to a beam-steering device or other elements, such as using a self-aligning mechanical configuration.

Optical illuminator module and related techniques

An array of acoustic transducing unit cells configured with an acoustic focus or a beam steering orientation. A variety of time delays between consecutively coupled acoustic transducing unit cells provides acoustic focus. In another configuration, a resistive signal path between adjacent acoustic transducing unit cells can be used to acoustically steer an acoustic beam in a direction non-normal to the top surface in which the array is disposed. In a further embodiment, a signal pad is made available at each end of the connections through an array of capacitive micromachined ultrasonic transducing unit cells.

Acoustic transducer chip

A method of producing a MEMS device provides a first substrate having a first interior surface and thickness, and a second substrate having a second interior surface. The method also forms at least one closed wall on at least one of the first and second substrates, weakens the first substrate in a plane generally parallel to the first interior surface, and secures the first substrate to the second substrate. The at least one closed wall extends between the first interior surface and the second interior surface. The method further separates a portion of the first substrate along the plane generally parallel to the first interior surface after securing the first and second substrates, and removes an excess portion of the first substrate to produce a reduced thickness first substrate of no greater than about 20 microns.

Method of forming MEMS device with weakened substrate

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Lexington, MA, United States of America

Christophe Antoine