Enthone Incorporated

Apple Inc.

Other

Macdermid Enthone Gmbh

Christoph Werner

Hani Esmaeili

Andreas Möbius

Ulrich Prinz

Franz-Josef Stark

Michael W Barnstead

Andreas Königshofen

Mark Peter Schildmann

Eric Steven Jol

Robert Scritzky

Raymund W M Kwok

Sean R Novak

Ida Y Lo

Peter Pies

Danica Elbick

Axel Fuhrmann

Frank Noffke

Holly Ubellacker

Judy Hsien-Chih Liu

Christoph Bitterlich

Wolfgang Clauberg

Xiaoqiang Huang

Kenneth Michael Bagwell

Methods of coating contacts to have a specific color. The color can be selected to match a color of a portion of a device enclosure for an electronic device housing the contacts. Examples can instead provide methods of coating contacts to have a color to contrast with a color of a portion of the device enclosure. These methods can provide electrical contacts having a low contact resistance and good corrosion and scratch resistance.

Electrical contact appearance and protection

The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.

Chromium-free plating-on-plastic etch

Contacts that can be highly corrosion resistant, can be readily manufactured, and can conserve precious materials. One example can provide contacts having a layer of a precious-metal alloy to improve corrosion resistance. The precious-metal-alloy layer can be plated with a hard, durable, wear and corrosion resistant plating stack for further corrosion resistance and wear improvement. The resources consumed by a contact can be reduced by forming a bulk or substrate region of the contact using a more readily available material, such as copper or a material that is primarily copper based.

Precious-metal-alloy contacts

A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions.

Chromium-free pickle for plastic surfaces

A plating formulation for the electroless deposition of a metal layer on a substrate, wherein a &#x3b2;-amino acid and/or &#x3b2;-amino acid derivative is used as a stabilizer. The &#x3b2;-amino acid is present within a range of 1 mg/L to 2 g/L. Typically, the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between &#x2212;2 and +5. The inventive plating formulation can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid.

Beta-amino acid comprising plating formulation

The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between &#x2212;2 and +5, and in which instead a &#x3b2;-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of &#x3b2;-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.

Method for the deposition of a metal layer comprising a beta-amino acid

A method and apparatus involving at least two distinct adsorbent media for adsorptive removal of impurities from a metal deposition composition such as an electroless or electrolytic deposition composition.

Method for removing impurities from a metal deposition process solution

An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises

Electrolyte and process for depositing a matt metal layer

Growing community of inventors

Düsseldorf, Germany

Christoph Werner