Technische Unversität Berlin

Sicoya Gmbh

Technische Universitaet Berlin

Christoph Theiss

Stefan Meister

Hanjo Rhee

Aws Al-Saadi

Moritz Grehn

Sebastian Kupijai

Sven Otte

Lars Zimmermann

Thorsten Kettler

David Selicke

Marvin Henniges

Muhammad Atif

David Stolarek

An optoelectronic component includes a chip having a substrate and at least one optical waveguide integrated in the chip. The electro-optical component may be monolithically integrated in one or a plurality of semiconductor layers of the chip arranged on the substrate top side of the substrate, or on the substrate top side of the substrate. At least one electrical connection of the monolithically integrated electro-optical component is connected by means of a connection line to a conductor track connection situated below the substrate rear side. The connection line extends through a hole in the substrate from the electro-optical component to the conductor track connection situated below the substrate rear side.

Optoelectronic component

An optoelectronic component including an optical waveguide integrated into a plane of the component. The optical waveguide configured to guide optical radiation in the plane. The component including a coupling element connected to the waveguide and coupling optical radiation into the waveguide along the main coupling path. The degree of coupling efficiency of the coupling element is less than one in respect to the main coupling path. The coupling element outputs optical loss radiation along a secondary coupling path. The optical loss radiation is proportional to the radiation transferred along the main coupling path. The optoelectronic component includes a detector connected to the coupling element that registers the optical loss radiation and produces a detector signal. The optoelectronic component includes a control unit configured to influence at least one operating variable of the optoelectronic component based on the detector signal.

A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.

Photonic component and method for producing same

An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.

Optical assembly

An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.

Optoelectronic component having a resonator

An injection modulator for modulation of optical radiation, having an optical waveguide and a diode structure, having at least two p-doped semiconductor portions, at least two n-doped semiconductor portions and at least one lightly or undoped intermediate portion between the p-doped and n-doped portions. The p-doped portions when viewed in the longitudinal direction of the waveguide are offset with respect to the n-doped portions and the diode structure is arranged in a resonance-free portion of the waveguide. The p-doped portions lie on one side of the waveguide, the n-doped portions lie on the other side of the waveguide and the intermediate portion lies in the center, each portion extends transversely with respect to the waveguide longitudinal direction in the direction of the waveguide center of the waveguide and no p-doped portion when viewed in the longitudinal direction of the waveguide overlaps any n-doped portion.

Growing community of inventors

Berlin, Germany

Christoph Theiss