Zkw Group Gmbh

Christoph Rainer

Christoph Haiden

Johannes Spitzer

A method for soldering an SMD component to a circuit carrier in a positionally stable manner, includes: a) providing a circuit carrier including a printed circuit board (PCB) contact surface, which is coated with a soldering paste (SP); b) applying an adhesive point onto the circuit carrier wherein the adhesive point delimits the PCB contact surface coated with SP; c) placing an SMD component, which includes a component contact surface, on the PCB contact surface coated with SP wherein the component contact surface contacts the PCB contact surface via the SP and the SMD component rests on the SP without contacting the adhesive point; d) waiting to complete a curing process of the adhesive point; and e) heating, melting and subsequently cooling the SP to produce an electric, thermal and/or a mechanical connection between the component and PCB contact surfaces, wherein the SMD component is allowed to vertically sink in molten SP and is mechanically restricted from drifting horizontally on the molten SP by means of a barrier.

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Aspang, Austria

Christoph Rainer