Pink Gmbh Thermosysteme

Christoph Oetzel

Stefan Müssig

Sebastian Clärding

Thomas Krebs

Aaron Hutzler

Sebastian Clarding

The invention relates to a diffusion soldering device and/or sintering device, to a press tool and to a system comprising these for connecting components of at least one electronic assembly, in particular of a plurality of electronic assemblies, by means of diffusion soldering or pressure sintering. The device comprises an upper tool and a lower tool between which the assemblies are held, wherein the upper tool has at least one pressure pad filled or fillable with a fluid or displaceable medium whose internal pressure is variable and at least one, in particular several, plungers in operative connection to the pressure pad and configured for transmission of a press force, generated by a pressure increase in the pressure pad, to the assemblies. The present invention provides that the upper tool has a guide frame in which the plunger(s) is/are guided axially movable along the effective direction of the press force, and the plunger(s) is/are movably guided inside the guide frame while sealed against the pressure pad. In a subordinate aspect, a press tool is proposed that is usable in an aforementioned diffusion soldering or sintering device, and a multi-module system comprising a press tool and/or an aforementioned device.

Diffusion soldering and/or sintering device, die and system, for connecting components of at least one electronic assembly

The present invention relates to a sintering device or diffusion soldering device for connecting components of at least one electronic assembly by means of pressure sintering, comprising an evacuatable process chamber in which an upper tool and a lower tool are arranged, between which the assembly is held and which are displaceable relative to one another in their distance apart to exert a press force, wherein the process chamber comprises a base body having on its upper side an access opening and a cover which is adjustable between a closed position in which the access opening is closed by the cover and an open position, wherein the upper tool is supported on the cover in the closed position of the cover at least during the exertion of the press force.

Multifunctional sintering or diffusion soldering device and pressing tool

A system for connecting electronic assemblies and/or for manufacturing workpieces has a plurality of modules for connecting the electronic assemblies and/or for manufacturing the workpieces. At least one module is a loading station and one is an unloading station, or one module is a loading station and unloading station. At least one further module is a manufacturing station, and a manufacturing workpiece carrier is provided for accommodating the electronic assemblies and/or workpieces which is movable in automated manner by a conveying unit from the loading station via the manufacturing station to the unloading station. A multiple gripper is provided by which at least two electronic assemblies and/or workpieces are simultaneously placeable onto the manufacturing workpiece carrier. A foil/film transfer unit and a foil/film detachment unit and a manufacturing workpiece carrier with at least two workpieces is provided. A method for connecting electronic assemblies and/or for manufacturing workpieces is provided.

System and method for connecting electronic assemblies

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

Soldering or sintering system with plurality of modules and temperature control

A method and system for connecting electronic assemblies and/or for manufacturing workpieces, having a plurality of modules for connecting the electronic assemblies, includes at least one module configured as a loading station and/or unloading station. At least one further module is configured as a manufacturing station. A manufacturing workpiece carrier is provided for accommodating the electronic assemblies and/or the workpieces, and is movable in automated manner by way of a conveying unit from the loading station via the manufacturing station to the unloading station. The system is configured in particular for assembly line production. In a secondary aspect, a foil/film transfer unit is proposed which provides automated application of foils/films as a process cover in the loading station.

The invention relates to a method for producing a solder connection between a plurality of components (A,B) in a process chamber () sealed off from its surroundings by heating and melting solder material () which is arranged between the components (A,B) to be connected. It is proposed that the components (A,B) to be connected are provisionally connected with a bonding material () to form a solder group () in which the components (A,B) are fixed relative to one another in a joining position.

Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components

A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.

Heat transfer device for producing a soldered connection of electrical components

A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.

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Freudenberg-Boxtal, Germany

Christoph Oetzel