Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Intel Deutschland Gmbh

Intel Corporation

Christoph Kutter

Georg Meyer-Berg

Ewald Soutschek

Martin Richter

Christof Landesberger

Yuecel Congar

Siegfried Roehl

Peter Ramm

Martin Wackerle

Dieter Bollmann

Dietrich Dumler

Li Carlos Rendler

Franz Wenninger

Indranil Bose

Christoph Jenke

Christian Reichel

Siegfried Röhl

Max Mittag

Holger Neuhaus

Bassem Badawi

Luis Eduardo Alanis

A solar cell module, having at least one first module segment, wherein the first module segment includes a first subsegment and at least one second subsegment, the first and the second subsegment each have at least one solar cell string and each solar cell string has a plurality of solar cells interconnected in series. The first module segment includes a first and an at least second bypass element and bypass connectors. These bypass elements are interconnected via the bypass connectors within the module segment. The shading properties, the electrical characteristics and the material expenditure in the production of the solar module are advantageously adapted via advantageous circuit and geometry arrangements of the elements.

Solar-cell module

Embodiments of the invention provide an image sensor image sensor including an image sensor structure. The image sensor structure includes a multitude of image elements arranged in a grid-shaped manner in a first direction and in a second direction orthogonal to the first direction. An image element of the multitude of image elements includes a plurality of filter elements spatially arranged side by side. The plurality of filter elements includes at least one color filter and at least one additional filter from a filter group. The filter group includes a first absorption filter with a first optical bandwidth, a second absorption filter with a second optical bandwidth different from the first optical bandwidth, a first polarization filter with a first polarization characteristic, a second polarization filter with a second polarization characteristic different from the first polarization characteristic, and a filter element without absorption effect or polarization effect.

Image sensor, method for operating an image sensor, method for manufacturing an image sensor, and stationary device or vehicle or drone having an image sensor

A method for producing a micropump includes, among others, a step of providing a substrate, wherein the substrate includes at least one pump diaphragm for the micropump. Additionally, a diaphragm actuator for moving the pump diaphragm is provided, wherein the diaphragm actuator is arranged in an holding device. The holding device is aligned relative to the substrate such that the diaphragm actuator is arranged opposite to the pump diaphragm and the pump diaphragm is deflected in the direction of the diaphragm actuator by means of a fluid pressure that is higher than the ambient pressure. Additionally, the diaphragm actuator is mounted on the pump diaphragm.

Method for producing a micropump with mechanically biased diaphragm actuator

A semiconductor device including a semiconductor chip having a first conduction element; a substrate having second and third conduction elements; and external connection elements configured to form an electrical path between the second and third conduction elements via the first conduction element.

Semiconductor device

Embodiments provide a method for manufacturing a microelectronic arrangement. The method includes a step of providing a chip-film module with a semiconductor chip and a film substrate having arranged thereon the semiconductor chip, wherein the chip-film module includes at least one coupling element spaced apart from the semiconductor chip and electrically coupled to at least one terminal of the semiconductor chip. Furthermore, the method includes a step of embedding the chip-film module into a printed circuit board, wherein, in embedding the chip-film module into the printed circuit board, the at least one coupling element of the chip-film module is coupled vertically [e.g. in the vertical direction [e.g. in relation to the printed circuit board]] [e.g. perpendicular to a surface of the printed circuit board] to at least one coupling counter element of the printed circuit board.

Microelectronic arrangement and method for manufacturing the same

The invention relates to a combined pump-sensor arrangement having a substrate having a first main surface and an opposite second main surface. A package lid which defines a package having a measuring cavity is arranged on the first main surface of the substrate. Additionally, the pump-sensor arrangement has a micropump having a pump inlet and a pump outlet, the micropump being configured to suck in an analyte fluid present in the measuring cavity through the pump inlet and eject the same to an environment outside the measuring cavity via the pump outlet. Furthermore, the pump-sensor arrangement has a sensor for detecting at least one component of the analyte fluid present within the measuring cavity and movable by means of the micropump. In accordance with the invention, both the sensor and the micropump are commonly arranged on the first main surface of the substrate and within the measuring cavity.

Combined pump-sensor arrangement

Among other things, the invention concerns an apparatus for securing a product against forgery, the apparatus including a microchip with an integrated circuit that may be read out in a contactless manner, a first metallization layer arranged on a first chip side of the microchip, and a second metallization layer arranged on a second chip side opposite to the first chip side. The first and second metallization layers are each electrically coupled to the integrated circuit and function as electrodes for a capacitive readout of the integrated circuit. The microchip is fixable to the product or integrable into the product. The invention further concerns the use of a microchip as a security feature in a product as well as a method for securing a product against forgery.

Apparatus and method for securing a product against forgery

A mobile device includes an opening defining a fluid connection between a fluid channel in the mobile device and ambient air, and a sensor arranged in the fluid channel, configured to sense at least one component of the ambient air. The mobile device further includes a micropump configured to draw in the ambient air through the opening and to convey the same to the sensor. According to the invention, the sensor is arranged spaced apart from the opening, and the volume of the fluid channel between the sensor and the opening is less than 200 microliters.

Mobile device for determining a component in ambient air

Carrier wafers are used to hold thin and ultra-thin substrates such as semiconductor components, for example. The carrier wafer of the invention has a plurality of electrodes insulated on all sides (floating electrodes). This plurality of floating electrodes, but at least 50 floating electrodes, are located next to one another with reference to the plane of the first surface of the carrier wafer. Each of these floating electrodes can be charged, for example by means of Fowler-Nordheim tunnels or by the injection of hot charge carriers, in particular of hot electrons or hot holes. Also provided are a method for holding a flexible substrate by means of a carrier wafer of this type and a method for the manufacture of a carrier wafer of this type.

Growing community of inventors

Munich, Germany

Christoph Kutter