Osram Oled Gmbh

Osram Opto Semiconductors Gmbh

Christoph Koller

Jörg Erich Sorg

Frank Singer

Thomas Schwarz

Stefan Groetsch

Andreas Dobner

Joerg Sorg

The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.

Semiconductor laser

In one embodiment, the optoelectronic semiconductor component () comprises a semiconductor chip () for generating radiation and an inorganic housing (). The semiconductor chip () is accommodated in a hermetically sealed manner in the housing (). The housing () has a preferably ceramic base plate (), a cover plate () and at least one preferably ceramic housing ring () and a plurality of electrical through-connections (). A recess (), in which the semiconductor chip () is located, is formed by the housing ring (). The base plate () has a plurality of electrical connection surfaces () on a component underside (). A plurality of through-connections () each extend through the base plate (), through the cover plate () and through the housing ring (). The base plate (), the at least one housing ring () and the cover plate () are firmly connected to one another via continuous, peripheral inorganic sealing frames (). Finally, the housing () comprises a radiation exit region () for emitting radiation.

Optoelectronic semiconductor component, and method for producing an optoelectronic semiconductor component

Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protection element is electrically conductively connected to the third electrically conductive structure and the first or second electrically conductive structure.

Electronic component and method for producing an electronic component

Growing community of inventors

Nittendorf, Germany

Christoph Koller