Robert Boschgmbh

Akustica, Inc.

Christoph Hermes

Thomas Friedrich

Heribert Weber

Peter Schmollngruber

Hans Artmann

Volkmar Senz

Bernhard Gehl

Andreas Scheurle

Kerrin Doessel

Jochen Reinmuth

Andrew Jonathan Doller

Arnim Hoechst

Mawuli Ametowobla

Daniel Meisel

Yujie Zhang

Gokhan Hatipoglu

Juergen Butz

Tobias Joachim Menold

A micromechanical component for a sensor device or microphone device. The micromechanical component includes a diaphragm with a diaphragm inner side to which an electrode structure is directly or indirectly connected; and a cavity that is formed at least in a volume that is exposed by at least one removed area of at least one sacrificial layer. At least one residual area made of at least one electrically insulating sacrificial layer material of the at least one sacrificial layer is also present at the micromechanical component, and including at least one insulation area made of at least one electrically insulating material that is not the same as the electrically insulating sacrificial layer material. The electrode structure is electrically insulated from the diaphragm, and/or the at least one residual area of the at least one sacrificial layer is delimited from the cavity, using the at least one insulation area.

Micromechanical component for a sensor device or microphone device

A micromechanical component for a capacitive pressure sensor device, including a diaphragm that is stretched with the aid of a frame structure in such a way that a cantilevered area of the diaphragm spans a framed partial surface, and including a reinforcement structure that is formed at the cantilevered area. A first spatial direction oriented in parallel to the framed partial surface is definable in which the cantilevered area has a minimal extension, and a second spatial direction oriented in parallel to the framed partial surface and oriented perpendicularly with respect to the first spatial direction is definable in which the cantilevered area has a greater extension. The reinforcement structure is present at a first distance from the frame structure in the first spatial direction, and at a second distance in the second spatial direction, the second distance being greater than the first distance.

Micromechanical component for a capacitive pressure sensor device

A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.

A sensor device having a first counter electrode extending under an intermediate carrier, and having a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region, and the first counter electrode encompassing, under the intermediate carrier, at least one electrically separated region that is disposed below a spacing element and includes at least a lateral extent of the spacing element.

MEMS capacitive sensor including improved contact separation

A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.

Micromechanical component and method for manufacturing a micromechanical component

A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

Micromechanical sensor unit and method for manufacturing a micromechanical sensor unit

A method for sealing entries in a MEMS element. The method includes: providing a functional layer having a functional region; producing a cavity underneath the functional region of the functional layer with the aid of a first entry outside of the functional region of the functional layer; sealing the first entry; producing a second entry to the cavity outside of the functional region of the functional layer; melting sealing material in the region of the second entry; and cooling off the melted sealing material to seal the second entry.

Method for sealing entries in a MEMS element

A MEMS sensor including a diaphragm, a base surface area of the diaphragm being delimited with the aid of a peripheral wall structure, and the base surface area including at least two subareas, of which at least one of the subareas is deflectably situated, and the at least two subareas being separated from one another with the aid of at least one separating structure or being delimited by the latter. The separating structure includes at least one fluid through-opening for the passage of fluid.

MEMS sensor including a diaphragm and method for manufacturing a MEMS sensor

A method for closing openings in a flexible diaphragm of a MEMS element. The method includes: providing at least one opening in the flexible diaphragm, situating sealing material in the area of the at least one opening, melting-on at least the applied sealing material in the area of the at least one opening, and subsequently cooling the melted-on material to close the at least one opening.

Method for closing openings in a flexible diaphragm of a MEMS element

A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.

A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.

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Kirchentellinsfurt, Germany

Christoph Hermes