Carl Zeiss Smt Gmbh

Infineon Technologies Ag

Christof Jalics

Holger Kierey

Eric Eva

Uwe Hoeckele

Vitaliy Shklover

Ralf Winter

Reinhard Goellner

Walter Preis

Sandra Obernhuber

Robert Meier

Joerg Adler

Patricia Nickut

Dirk Heinrich Ehm

Stefan-Wolfgang Schmidt

Moritz Becker

Stefan Wiesner

Arno Schmittner

Alexey Sergeevich Kuznetsov

Irene Ament

Wolfgang Merkel

Christoph Nottbohm

Tanja Schest

Diana Urich

Tanja Ippisch

Fabian Schuster

Andreas Sandner

Tobias Meisch

A mirror for an illumination optical unit of a projection exposure apparatus comprises a spectral filter in the form of a grating structure, wherein the grating structure has a maximum edge steepness in the range of 15° to 60°.

Mirror for an illumination optical unit of a projection exposure apparatus comprising a spectral filter in the form of a grating structure and method for producing a spectral filter in the form of a grating structure on a mirror

A cost-effective method for repairing reflective optical elements for EUV lithography. These optical elements () have a substrate () and a coating () that reflects at a working wavelength in the range between 5 nm and 20 nm and is damaged as a result of formation of hydrogen bubbles. The method includes: localizing a damaged area () in the coating () and covering the damaged area () with one or more materials having low hydrogen permeability by applying a cover element to the damaged area. The cover element is formed of a surface structure, a convex or concave surface, or a coating corresponding to the coating of the reflective optical element, or a combination thereof. The method is particularly suitable for collector mirrors () for EUV lithography. After the repair, the optical elements have cover elements ().

Method for repairing reflective optical elements for EUV lithography

In order to prevent delamination of a reflective coating from the substrate under the influence of reactive hydrogen, a reflective optical element () for EUV lithography is provided, which has a substrate () and a reflective coating () for reflecting radiation in the wavelength range of 5 nm to 20 nm. A functional layer () is arranged between the reflective coating () and the substrate (). With the functional layer, the concentration of hydrogen in atom % at the side of the substrate facing the reflective coating is reduced by at least a factor of 2.

Reflective optical element for EUV lithography

A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.

Method for manufacturing a device on a substrate

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Heidenheim, Germany

Christof Jalics