Osram Gmbh

Osram Ag

Osram Gesellschaft MIT Beschraenkter Haftung

Christine Maier

Ralph Wirth

Frank Jermann

Krister Bergenek

Stefan Lange

Andreas Biebersdorf

Robert Kraus

Joerg Sorg

Axel Kaltenbacher

Giovanni Scilla

Gertrud Kraeuter

Harald Jaeger

Steffen Strauss

Thomas Donauer

Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.

Optoelectronic component with inert gas atmosphere

A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby.

Lighting module

The protective sheath has a basis for attaching the LED band and an at least partially light-transmissive covering attachable thereto, wherein the basis and the covering form an accommodation space for the LED band in the attached state.

Protective sheath for a LED band

Growing community of inventors

Asselfingen, Germany

Christine Maier