Pionetics Corporation

Other

Tyco Electronics Corporation

Simbol, Inc.

Christine Ellen Vogdes

Robert H Reamey

Eric David Nyberg

Paul G Schoenstein

Benjamin Lee Sitler

James Crawford Holmes

Ashok Kumar Janah

Ray F Stewart

Stephen Harrison

John Burba

Brian E Viani

John Galil Salim Lahlouh

A fluid treatment apparatus comprises an electrochemical cell having fluid orifices to receive input fluid and release output fluid, the input fluid having a first level of a microorganism. First and second electrodes are about a water-splitting membrane in the electrochemical cell. A valve controls the flow of fluid through fluid orifices of the electrochemical cell. A power supply supplies a current to the first and second electrodes. A control module comprises program code to operate the valve to flow the input fluid into a fluid orifice of the electrochemical cell and provide a residence time of the fluid in the cell of at least 0.05 minutes, while controlling the power supply to supply to the first and second electrodes, a current having a current density of from about 0.01 to about 20 mA/cm.

Electrochemical ion exchange treatment of fluids

This invention relates to a method for preparing a lithium aluminate intercalate (LAI) matrix solid and methods for the selective extraction and recovery of lithium from lithium containing solutions, including brines. The method for preparing the LAI matrix solid includes reacting aluminum hydroxide and a lithium salt for form the lithium aluminate intercalate, which can then be mixed with up to about 20% by weight of a polymer to form the LAI matrix.

Sorbent for lithium extraction

A fluid treatment apparatus for treating a fluid comprises an electrochemical cell having fluid orifices to receive and release fluid, and a fluid passageway connecting the orifices with a water-splitting ion exchange membrane is exposed to the fluid in the passageway. First and second electrodes are positioned about the membrane. The apparatus also comprises a controller to control and operate a power supply and valve system. The power supply supplies a current to the first and second electrodes at sufficiently high current density to result in bacteriostasis, deactivation, or a reduction in the microorganisms in the fluid. The controller can also operate a set of cells to deionize fluid and regenerate the cells.

A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-&deg;C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Dissipation of heat from a circuit board having bare silicon chips mounted thereon

A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-.degree. C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Dissipation of heat from a circuit board having bare silicon chips

Growing community of inventors

Sunnyvale, CA, United States of America

Christine Ellen Vogdes