Qorvo Us, Inc.

Christine Blair

Kelly M Lear

Jeffrey Miller

Mihir Roy

Robert Charles Dry

The present disclosure relates to a system in package having a chiplet with a first substrate and a first die deposed over the first substrate, a second die, a second substrate that the chiplet and the second die are deposed over, and a heatsink spreader deposed over the chiplet and the second die. Herein, the first substrate includes layered-cake shaped heatsink stanchions that are coupled to the first die, and the second substrate includes layered-cake shaped heatsink stanchions that are coupled to the chiplet and the second die. As such, heat generated by the first die can be dissipated by the heatsink stanchions within the first and second substrates, and heat generated by the second die can be dissipated by the heatsink stanchions within the second substrate. Furthermore, the heat generated by the first die and the second die can be dissipated by the heatsink spreader above them.

System in package with flip chip die over multi-layer heatsink stanchion

The present disclosure relates to an air-cavity semiconductor package, which includes a thermal carrier, a ring structure, a package lid, and at least one semiconductor device. The thermal carrier has a carrier body, a heat slug residing within the carrier body, a top coating layer formed over a top surface of the heat slug, and a bottom coating layer formed over a bottom surface of the heat slug. The ring structure includes a ring body with an interior opening, which resides over the thermal carrier, such that a portion of a top surface of the thermal carrier is exposed through the interior opening. The package lid resides over the ring structure and has a recess conjoined with the interior opening forming an enclosed cavity. The at least one semiconductor device is attached to the exposed portion of the top surface of the thermal carrier and encapsulated in the enclosed cavity.

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Lewisville, TX, United States of America

Christine Blair