Neuroloop Gmbh

Christina Sebastian Hassler

Tim Boretius

Fabian Kimmig

Dennis Plachta

A device for the extravasal or extraneuronal fastening of a medical implant has a biocompatible surface substrate including a first substrate portion which is a compression sleeve and a free end portion. By winding the first substrate portion about a spatial axis, the axis is loosely radially covered in at least one layer by the wound first substrate portion. A second substrate portion, which is attached integrally to the first substrate portion which is not wound about the spatial axis, has a connection extending away from the medical implant.

Device for extravasal or extraneuronal fastening of a medical implant in the manner of a compression sleeve

An implantable electrical contact arrangement is described which has at least one electrode body arrangement composed otherwise entirely of biocompatible, electrically insulating material, with at least one freely accessible electrode surface enclosed directly or indirectly by the biocompatible electrically insulating material. The invention is characterized in that the electrode body arrangement has a stack-shaped layer composite which provides at least one gold layer connected to an iridium layer via a diffusion barrier layer. The stack-shaped layer composite by being completely encapsulated by an SiC layer, with the exception of at least one surface region of the iridium layer facing to be directed away from the layer composite. The SiC layer has an SiC layer surface which is facing to be directed away from the stack-shaped layer composite and which is adjoined directly or indirectly by the biocompatible, electrically insulating material.

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Reute, Germany

Christina Sebastian Hassler