Micron Technology Incorporated

Christina Papagianni

Innocenzo Tortorelli

Stephen H Tang

Zhenming Zhou

Murong Lang

Fabio Pellizzer

Hongmei Wang

Gianpaolo Spadini

Foroozan Sarah Koushan

Robert J Gleixner

Zhongyuan Lu

Jong Won Lee

Peng Zhang

Ting Luo

Aspects of the present disclosure configure a system component, such as memory sub-system controller, to perform empty page scan operations. The controller selects a portion of the set of memory components that is empty and ready to be programmed. The controller reads one or more signals from the selected portion of the set of memory components. The controller generates an error count value representing whether the portion of the set of memory components is valid for programming based on a result of reading the one or more signals from the selected portion. The controller updates a scan frequency for performing the empty page scan operations for the portion of the set of memory components based on the error count value.

Empty page scan operations adjustment

Methods, systems, and devices for cross-temperature mitigation in a memory system are described. A memory system may determine a first temperature of the memory system. Based on the first temperature satisfying a first threshold, the memory system may write a set of data to a first block of the memory system that is configured with a first rate for performing scan operations to determine error information for the first block. The memory system may then determine a second temperature of the memory system after writing the set of data to the first block. Based on the second temperature satisfying a second threshold, the memory system may transfer the set of data to a second block of the memory system that is configured with a second rate for performing scan operations to determine error information for the second block.

Cross-temperature mitigation in a memory system

Methods, systems, and devices for write operation techniques for memory systems are described. In some memory systems, write operations performed on target memory cells of the memory device may disturb logic states stored by one or more adjacent memory cells. Such disturbances may cause reductions in read margins when accessing one or more memory cells, or may cause a loss of data in one or more memory cells. The described techniques may reduce aspects of logic state degradation by supporting operational modes where a host device, a memory device, or both, refrains from writing information to a region of a memory array, or inhibits write commands associated with write operations on a region of a memory array.

Write operation techniques for memory systems

Disclosed herein is a memory cell. The memory cell may act both as a combined selector device and memory element. The memory cell may be programmed by applying write pulses having different polarities. Different polarities of the write pulses may program different logic states into the memory cell. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities of the write pulses.

Apparatuses and methods including memory and operation of same

A first write operation is performed to write a first portion of a set of host data to a first location of a memory device. It is determined whether a first elapsed time since the first operation is performed does not satisfy a time condition. Responsive to determining that the first elapsed time does not satisfy the time condition, a second write operation is performed to write a second portion of the set of host data to a second location of the memory device not adjacent to the first location.

Write operations to mitigate write disturb

A request to write a set of host data is received. A first plurality of write operations is performed to write a first portion of the set of host data to a first set of memory cells of the memory device arranged in a first pattern. The first set of memory cells arranged in the first pattern comprises alternating memory cells on each word line of the memory device and excludes a second set of memory cells adjacent to the first set of memory cells. A second plurality of write operations is performed to write a second portion of the set of host data to the second set of memory cells arranged in a second pattern. The second set of memory cells arranged in the second pattern comprises other alternating memory cells on each word line of the memory device adjacent to the first set of memory cells.

Material test structures having cantilever portions and methods of forming the same are described herein. As an example, a method of forming a material test structure includes forming a number of electrode portions in a first dielectric material, forming a second dielectric material on the first dielectric material, wherein the second dielectric material includes a first cantilever portion and a second cantilever portion, and forming a test material on the number of electrode portions, the first dielectric material, and the second dielectric material.

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San Jose, CA, United States of America

Christina Papagianni