International Business Machines Corporation

Christina Marie Pepi

Stephen Peter Ayotte

Timothy M Sullivan

David J Hill

Kristen L Holverson

A heat sink for cooling a heat-generating device includes a base and a cooling section coupled thereto for cooling the device. The cooling section includes a plurality of flow tubes, each flow tube having an inlet, an outlet, and a bounding wall that defines a closed fluid flow path from the inlet to the outlet. Each of the flow tubes includes a central axis that is substantially parallel to a reference plane of the heat-generating device. The flow tubes may be arranged in a layered stack and include a bounding wall that has a thickness that decreases with increasing distance in the layered stack. The flow tubes may also include a cross-sectional area that decreases with increasing distance in the layered stack. Furthermore, the bounding wall of the flow tubes may have a non-planar configuration in a direction generally parallel to the central axis.

Low profile heat sink for semiconductor devices

An electronic device. The device including a module having opposite top surface and bottom surfaces; a first set of pads on the top surface of the module and a second set of pads on the bottom surface of the module substrate, wires within the module electrically connecting the first set of pads to the second set of pads; a set of solder interconnects in electrical and physical contact with a the second set of module pads; and a dielectric underfill layer formed on the bottom surface of the module, the underfill layer filling the space between lower regions of the solder interconnects of the set of solder interconnects, upper regions of the solder interconnects of the set of solder interconnects extending past a top surface of the underfill layer.

Growing community of inventors

Underhill, VT, United States of America

Christina Marie Pepi