Asm International N.v.

Christianus Gerardus Maria Ridder

Theodorus Gerardus Maria Oosterlaken

Vladimir Ivanovich Kuznetsov

Frank Huussen

Ernst Hendrik August Granneman

Albert Hasper

Jan Zinger

Gert-Jan Snijders

Jack Herman Van Putten

Cornelis Marinus Kooijman

Jeroen Jan Stoutjesdijk

For wafer processing, wafers are transferred between a thermal treatment chamber and a thermal treatment installation. The treatment chamber has a top section and a bottom section between which the wafer is accommodated during treatment. The thermal treatment installation has a loading chamber having loading means and transport means. The wafer is place on a wafer support while in the loading chamber, wherein the wafer support is configured as a ring having support elements to support the wafer. The wafer support loaded with the wafer is inserted into the thermal treatment chamber so that the wafer and the wafer support are positioned between the top section and the bottom section. The wafer is individually processed in the thermal treatment chamber. After processing the wafer, the wafer support is removed from the thermal treatment chamber.

Apparatus for transferring wafer and ring

Enhanced inserts are formed having a cylindrical grip and a protrusion extending from the grip. An ultra hard material layer is bonded on top of the protrusion. The inserts are mounted on a rock bit and contact the earth formations off center. The ultra hard material layer is thickest at a critical zone which encompasses a major portion of the region of contact between the insert and the earth formation. Transition layers may also be formed between the ultra hard material layer and the protrusion so as to reduce stresses formed on the interface between the ultra hard material and the protrusion.

Method and device for transferring wafers

Growing community of inventors

Hoogland, Netherlands

Christianus Gerardus Maria Ridder