Robert Boschgmbh

Christiane Frueh

Andreas Fix

Martin Rittner

Michael Guyenot

Michael Guenther

Rainer Holz

Franz Wetzl

Thomas Kalich

Bernd Hohenberger

Andrea Feiock

Laminated composite () comprising at least one electronic substrate () and an arrangement of layers () made up of at least a first layer () of a first metal and/or a first metal alloy and of a second layer () of a second metal and/or a second metal alloy adjacent to this first layer (), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (), a region with at least one intermetallic phase () is formed between the first layer and the second layer, wherein the first layer () or the second layer () is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite () and to a circuit arrangement containing a laminated composite () according to the invention.

Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder

The connection arrangement () comprises at least one electric and/or electronic component (). The at least one electric and/or electronic component () has at least one connection face (), which is connected in a bonded manner to a join partner () by means of a connection layer (). The connection layer () can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer () is arranged adjacent to the connection layer () in a bonded manner. The reinforcement layer () has a higher modulus of elasticity than the connection layer (). A particularly good protective effect is achieved if the reinforcement layer () is formed in a frame-like manner by an outer and an inner boundary () and, at least with the outer boundary () thereof, encloses the connection face () of the at least one electric and/or electronic component ().

Connection arrangement of an electric and/or electronic component

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Ludwigsburg, Germany

Christiane Frueh